Abstract

An impurity diffusion-reaction model is applied to Cu migration in CdTe layer of CdTe solar cells. In this simulation, the reactions between major defects, such as Cu interstitials, Cd interstitials, Cd vacancies and Cu at Cd site, in CdTe and the diffusion of each of them are calculated numerically. The simulation yields transient Cu distributions in polycrystalline CdTe during solar cell processing. Preliminary results for Cu migration in CdTe photovoltaic devices using available diffusivity and solubility data from the literature show that Cu accumulates near the back contact, a phenomena that is commonly observed in devices after back-contact processing or stress conditions.

Original languageEnglish (US)
Title of host publicationInternational Conference and Exhibition on Device Packaging 2014
PublisherInternational Microelectronics and Packaging Society, Nordic
Pages379-381
Number of pages3
ISBN (Print)9781632665812
StatePublished - Jan 1 2014
EventIMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference - Scottsdale/Fountain Hills, AZ, United States
Duration: Mar 10 2014Mar 13 2014

Publication series

NameInternational Conference and Exhibition on Device Packaging 2014

Other

OtherIMAPS International Conference and Exhibition on Device Packaging 2014, in Conjunction with the Global Business Council, GBC Spring Conference
CountryUnited States
CityScottsdale/Fountain Hills, AZ
Period3/10/143/13/14

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Keywords

  • CdTe
  • Copper
  • Grain boundaries
  • Impurity diffusion
  • Numerical simulation
  • Photovoltaic cells

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials

Cite this

Guo, D., Akis, R., Brinkman, D., Sankin, I., Fang, T., Vasileska, D., & Ringhofer, C. (2014). Cu migration in polycrystalline CdTe solar cells. In International Conference and Exhibition on Device Packaging 2014 (pp. 379-381). (International Conference and Exhibition on Device Packaging 2014). International Microelectronics and Packaging Society, Nordic.