Coupling reduction in high-speed, high-density digital interconnects with substrate compensation

James P.K. Gilb, Constantine Balanis

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

Reduced inter-line spacing and increased clock speeds result in higher coupling and distortion of high-speed signals in digital interconnects. Inter-line spacings of one center conductor width or less are desired to increase the density of interconnects. In addition, clock speeds in the Gbit/s range and rise times of less than 10ps are already under consideration for new designs. However, these high-speeds and tight spacings cause significant distortion of the signals and produce unacceptable levels of crosstalk in the circuit. A key to the successful design of electronic interconnects and packaging for high-speed, high-density systems is the control of coupling distortion and crosstalk.

Original languageEnglish (US)
Title of host publicationElectrical Performance of Electronic Packaging, EPEP 1992
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages116-118
Number of pages3
ISBN (Electronic)078030683X, 9780780306837
DOIs
StatePublished - Jan 1 1992
Event1992 Electrical Performance of Electronic Packaging, EPEP 1992 - Tucson, United States
Duration: Apr 22 1992Apr 24 1992

Publication series

NameElectrical Performance of Electronic Packaging, EPEP 1992

Conference

Conference1992 Electrical Performance of Electronic Packaging, EPEP 1992
CountryUnited States
CityTucson
Period4/22/924/24/92

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ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality
  • Electronic, Optical and Magnetic Materials

Cite this

Gilb, J. P. K., & Balanis, C. (1992). Coupling reduction in high-speed, high-density digital interconnects with substrate compensation. In Electrical Performance of Electronic Packaging, EPEP 1992 (pp. 116-118). [572282] (Electrical Performance of Electronic Packaging, EPEP 1992). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/EPEP.1992.572282