Coupled heat transfer and thermal stress in high-T_c thin-film superconductor devices

Engineering & Materials Science

• Superconducting materials 100%
• Peeling 80%
• Thermal stress 75%
• Thin films 72%
• Heat transfer 50%
• Substrates 35%
• Temperature distribution 20%
• Hot Temperature 18%
• Joule heating 16%
• Finite element method 15%
• Cryogenics 13%
• Stress analysis 12%
• Stress intensity factors 12%
• Heat losses 12%
• Current density 12%
• Temperature 10%

Physics & Astronomy

• peeling 96%
• thermal stresses 80%
• heat transfer 59%
• thin films 39%
• temperature distribution 24%
• stress analysis 18%
• Joule heating 17%
• stress intensity factors 16%
• cryogenic temperature 16%
• operating temperature 16%
• rooms 14%
• stress distribution 14%
• grain size 11%
• current density 10%
• cooling 10%
• temperature 4%

Chemical Compounds

• Superconductor 85%
• Heat Transfer 82%
• Liquid Film 36%
• Resistance 28%
• Cryogenics 16%
• Dissipation 16%
• Grain Size 14%
• Polycrystalline Solid 13%
• Heat 11%
• Current Density 11%
• Reduction 6%