Coupled heat transfer and thermal stress in high-Tc thin-film superconductor devices

B. Gu, Patrick Phelan, S. Mei

Research output: Contribution to journalArticle

5 Citations (Scopus)

Abstract

A coupled heat transfer and thermal stress analysis is developed for a thin-film high-Tc superconductor device. The thermal boundary resistance between the film and substrate, which is modelled as a function of interfacial peeling stress, is used to couple the structural and thermal sides of the model. The thermal stress generated from the temperature reduction from room to cryogenic operating temperatures, and the temperature field due to uniform Joule heating in the normal-state film, are calculated using finite element analysis. The resulting peeling stress, that is the normal stress at the film/substrate interface, and peeling stress intensity factor, are calculated for different substrate materials, different YBCO film lattice direction combinations, and different current densities. The finite element analysis demonstrates the importance of considering the thermal boundary resistance when calculating the peeling stress, although the peeling stress/thermal boundary resistance coupling is relatively insignificant for determining the resulting stress and temperature fields. The report suggests that a polycrystalline YBCO thin film with small grain size deposited on an MgO substrate is a good choice, since it has smaller stress in the film and better heat dissipation ability.

Original languageEnglish (US)
Pages (from-to)411-418
Number of pages8
JournalCryogenics
Volume38
Issue number4
StatePublished - Apr 1998

Fingerprint

thermal stresses
peeling
Peeling
Thermal stress
Superconducting materials
heat transfer
Heat transfer
Thin films
thin films
Substrates
Temperature distribution
temperature distribution
Finite element method
Joule heating
stress intensity factors
stress analysis
cryogenic temperature
Stress analysis
operating temperature
Heat losses

Keywords

  • High-temperature superconductors
  • Thermal boundary resistance
  • Thermal stress
  • Thin films

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics

Cite this

Coupled heat transfer and thermal stress in high-Tc thin-film superconductor devices. / Gu, B.; Phelan, Patrick; Mei, S.

In: Cryogenics, Vol. 38, No. 4, 04.1998, p. 411-418.

Research output: Contribution to journalArticle

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