Corrosion of titanium-nitride encapsulated silver films exposed to a H2S ambient

Daniel Adams, B. A. Julies, J. W. Mayer, Terry Alford

Research output: Contribution to journalArticle

11 Scopus citations

Abstract

Annealing of a Ag(19 at.% Ti)/SiO2/Si(100) structure in a flowing NH3 ambient resulted in the encapsulation of a silver film by a surface TiN of ∼20 nm and an interfacial TiOATi5Si3 bilayer. TiN is formed by the reaction of the segregated Ti and the NH3 ambient. The interfacial structure is a result of the dissociation of SiO2 into free O and Si followed by the reaction of it with Ti. To evaluate the effectiveness of the TiN encapsulation to protect the Ag against corrosion, the encapsulated silver films were annealed in a severe H2S ambient for 30 min, at temperatures ranging from 100-500°C. At temperatures ≥300°C silver diffuses to the surface to react with the H2S to form a non-uniform layer of rhombic and cubic Ag2S crystallites. The unprotected Ag(Ti) alloys and pure Ag on SiO2 corroded at 100°C, when annealed under the same conditions.

Original languageEnglish (US)
Pages (from-to)235-239
Number of pages5
JournalThin Solid Films
Volume332
Issue number1-2
DOIs
StatePublished - Nov 2 1998

    Fingerprint

Keywords

  • Acanthite
  • Corrosion
  • Silver metallization
  • Titanium nitride

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this