Correlation of stress and atomic-scale surface roughness evolution during intermittent homoepitaxial growth of (111)-oriented Ag and Cu

Cody Friesen, C. V. Thompson

Research output: Contribution to journalArticle

44 Citations (Scopus)

Abstract

Stress evolution during intermittent homoepitaxial growth of (111)-oriented Copper and Silver thin films was analyzed. The atomic scale surface roughness was also analyzed using reflection high energy electron diffraction. It was observed that reversible stress changes during interruptions of film growth were associated with changes in atomic scale surface structure. It was also observed that a change in tensile stress occurred when growth was stopped and reversed when growth was resumed.

Original languageEnglish (US)
Article number056104
JournalPhysical Review Letters
Volume93
Issue number5
DOIs
StatePublished - Jul 30 2004
Externally publishedYes

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surface roughness
interruption
tensile stress
high energy electrons
electron diffraction
silver
copper
thin films

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

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abstract = "Stress evolution during intermittent homoepitaxial growth of (111)-oriented Copper and Silver thin films was analyzed. The atomic scale surface roughness was also analyzed using reflection high energy electron diffraction. It was observed that reversible stress changes during interruptions of film growth were associated with changes in atomic scale surface structure. It was also observed that a change in tensile stress occurred when growth was stopped and reversed when growth was resumed.",
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