Correction to: Influence of Substrate Surface Finish Metallurgy on Lead-Free Solder Joint Microstructure with Implications for Board-Level Reliability (Journal of Electronic Materials, (2020), 49, 5, (3251-3258), 10.1007/s11664-020-08013-0)

Marion Branch Kelly, Tapabrata Maity, A. R. Nazmus Sakib, D. R. Frear, Nikhilesh Chawla

Research output: Contribution to journalComment/debatepeer-review

Abstract

In the original article, there is an error in Fig. 1. Following is the corrected Fig. 1. (Figure presented.).

Original languageEnglish (US)
Pages (from-to)4466-4467
Number of pages2
JournalJournal of Electronic Materials
Volume49
Issue number7
DOIs
StatePublished - Jul 1 2020

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Electrical and Electronic Engineering
  • Materials Chemistry

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