Copper-based metallization and interconnects for ultra-large-scale integration applications

Terry Alford, Jian Li, James W. Mayer, Wang Shi-Qing

Research output: Contribution to journalEditorial

1 Scopus citations
Original languageEnglish (US)
Pages (from-to)vii,viii
JournalThin Solid Films
Volume262
Issue number1-2
DOIs
StatePublished - Jun 15 1995

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Surfaces and Interfaces
  • Surfaces, Coatings and Films
  • Metals and Alloys
  • Materials Chemistry

Cite this