Contamination performance of silicone rubber cable terminations: Part II

Ravi S. Gorur, Harold Hervig, Leonard J. Johnson

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This study is a follow-up of a previous report describing a systematic study of the contamination performance of silicone rubber cable terminations in a fog chamber. The goal of the study is to aid the development of an artificial contamination laboratory test for evaluating the electrical performance of all types of polymeric terminations in the field. This is achieved by understanding the role played by the various experimental factors on the electrical performance. The effect of varying the test method off-time on the regeneration of the silicon rubber's hydrophobic or water repellant surface is studied. The effect of load current on dry band arcing, which occurs on a moist and contaminated surface of an energized termination and can result in material degradation or flashover, has also been evaluated. It has been shown for the first time that the surface temperature rise due to the full load current causes a significant reduction in dry band arcing activity and therefore has a beneficial effect on the contamination performance of polymeric terminations.

Original languageEnglish (US)
Title of host publicationProc 91 IEEE Power Eng Soc Transm Distrib Conf
Place of PublicationPiscataway, NJ, United States
PublisherPubl by IEEE
Pages238-242
Number of pages5
Publication statusPublished - 1992
EventProceedings of the 1991 IEEE Power Engineering Society Transmission and Distribution Conference - Dallas, TX, USA
Duration: Sep 22 1991Sep 27 1991

Other

OtherProceedings of the 1991 IEEE Power Engineering Society Transmission and Distribution Conference
CityDallas, TX, USA
Period9/22/919/27/91

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ASJC Scopus subject areas

  • Engineering(all)

Cite this

Gorur, R. S., Hervig, H., & Johnson, L. J. (1992). Contamination performance of silicone rubber cable terminations: Part II. In Proc 91 IEEE Power Eng Soc Transm Distrib Conf (pp. 238-242). Piscataway, NJ, United States: Publ by IEEE.