Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates

Kaustubh S. Gadre, Terry Alford

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42 Scopus citations

Abstract

Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.

Original languageEnglish (US)
Pages (from-to)919-923
Number of pages5
JournalJournal of Applied Physics
Volume93
Issue number2
DOIs
Publication statusPublished - Jan 15 2003

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ASJC Scopus subject areas

  • Physics and Astronomy(all)
  • Physics and Astronomy (miscellaneous)

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