Contact angle measurements for adhesion energy evaluation of silver and copper films on parylene-n and SiO2 substrates were presented. Qualitative tape-test analysis suggested improved adhesion between copper or silver and Pa-n using a plasma treatment prior to metal deposition. Contact angle measurements were shown applicable to evaluate adhesion energy quantitatively.
ASJC Scopus subject areas
- Physics and Astronomy(all)
- Physics and Astronomy (miscellaneous)