Complementary p- and n-channel quantum-well MI3SFET's

Richard Kiehl, M. A. Olson, K. Yoh, S. L. Wright, M. Heiblum, J. Yates, A. C. Warren

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Heterostructure design and device fabrication techniques for vertically integrated p- and n-channel quantum-well FETs are described, and the operation of FETs fabricated on a p/n double-quantum-well heterostructure is demonstrated. The dependence of parasitic resistance and gate leakage on heterostructure layer parameters and device geometry is examined in experiments. Contact and n+ sheet resistances as low as 0.2 Ω-mm and 385 Ω/2b, respectively, and peak transconductance values of 300 mS/mm are achieved in the best 1.5-μm n-FETs at 77 K. p-FETs fabricated on a double-quantum-well heterostructure by Zn diffusion show contact and p+ sheet resistances of approximately 0.5 Ω-mm and 200 Ω/2b, respectively, with peak transconductance of 80 mS/mm for 1.5-μm gates at 77 K. Gate leakage is sufficiently low in both p- and n-FETs to allow high-speed complementary logic and memory at supply voltages of 1.1 V.

Original languageEnglish (US)
Title of host publicationTechnical Digest - International Electron Devices Meeting
Editors Anon
PublisherPubl by IEEE
Pages684-687
Number of pages4
StatePublished - Dec 1988
Externally publishedYes
EventTechnical Digest - International Electron Devices Meeting 1988 - San Francisco, CA, USA
Duration: Dec 11 1988Dec 14 1988

Other

OtherTechnical Digest - International Electron Devices Meeting 1988
CitySan Francisco, CA, USA
Period12/11/8812/14/88

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Fingerprint Dive into the research topics of 'Complementary p- and n-channel quantum-well MI3SFET's'. Together they form a unique fingerprint.

  • Cite this

    Kiehl, R., Olson, M. A., Yoh, K., Wright, S. L., Heiblum, M., Yates, J., & Warren, A. C. (1988). Complementary p- and n-channel quantum-well MI3SFET's. In Anon (Ed.), Technical Digest - International Electron Devices Meeting (pp. 684-687). Publ by IEEE.