Comparison of wideband interconnecting technologies for multi-GHz novel memory architecture

Brahim Bensalem, James Aberle

Research output: Contribution to journalArticle

Abstract

Recently proposed multicarrier memory channel architecture (MCMCA) [1], [2] pioneered the use of substrate integrated waveguide (SIW) as a viable high bandwidth interconnect in memory channels. In this work, we validate the merit of our proposal by comparing it to leading transmission line-based bandpass filter (TLBPF). We show that in X-band, the SIW interconnect achieves more than two times higher bandwidth than TLBPF. TLBPF suffers from the impact of conductive attenuation which causes the outer symbols to drift in toward the center of the constellation diagram and results in an abrupt degradation in BER. The cumulative effects of such impairments causes TLBPF-based platform to saturate at 200 MHz rate (2400 Mbps). In contrast, SIW-based platform achieves 400 MHz transfer rate (4800 Mbps) without equalization and/or signal recovery algorithms while preserving a BER smaller than 3.0e-3 and an EVM less than 9.7%

Original languageEnglish (US)
JournalIEEE Transactions on Components, Packaging and Manufacturing Technology
DOIs
StateAccepted/In press - Jan 1 2018

Keywords

  • Band-pass filters
  • Bandwidth
  • DDR Memory
  • Hairpin Filter
  • Manufacturing
  • Mathematical model
  • Memory Wall
  • memory wall
  • Microwave filters
  • multicarrier memory
  • Resonators
  • Signal Integrity
  • SIW
  • Solid modeling

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Industrial and Manufacturing Engineering
  • Electrical and Electronic Engineering

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