Compact modeling of STT-MTJ for SPICE simulation

Zihan Xu, Ketul B. Sutaria, Chengen Yang, Chaitali Chakrabarti, Yu Cao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

STT-MTJ is a promising device for future high-density and low-power integrated systems. To enable design exploration of STT-MTJ, this paper presents a fully compact model for efficient SPICE simulation. Derived from the fundamental LLG equation, the new model consists of RC elements that are closed-form solutions of device geometry and material properties. They support transient SPICE simulations, providing necessary details beyond the macromodel. The accuracy is validated with numerical results and published data.

Original languageEnglish (US)
Title of host publicationESSDERC 2013 - Proceedings of the 43rd European Solid-State Device Research Conference
PublisherIEEE Computer Society
Pages338-341
Number of pages4
ISBN (Print)9781479906499
DOIs
StatePublished - Jan 1 2013
Event43rd European Solid-State Device Research Conference, ESSDERC 2013 - Bucharest, Romania
Duration: Sep 16 2013Sep 20 2013

Publication series

NameEuropean Solid-State Device Research Conference
ISSN (Print)1930-8876

Conference

Conference43rd European Solid-State Device Research Conference, ESSDERC 2013
CountryRomania
CityBucharest
Period9/16/139/20/13

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Safety, Risk, Reliability and Quality

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  • Cite this

    Xu, Z., Sutaria, K. B., Yang, C., Chakrabarti, C., & Cao, Y. (2013). Compact modeling of STT-MTJ for SPICE simulation. In ESSDERC 2013 - Proceedings of the 43rd European Solid-State Device Research Conference (pp. 338-341). [6818887] (European Solid-State Device Research Conference). IEEE Computer Society. https://doi.org/10.1109/ESSDERC.2013.6818887