TY - GEN
T1 - Compact modeling of STT-MTJ for SPICE simulation
AU - Xu, Zihan
AU - Sutaria, Ketul B.
AU - Yang, Chengen
AU - Chakrabarti, Chaitali
AU - Cao, Yu
PY - 2013/1/1
Y1 - 2013/1/1
N2 - STT-MTJ is a promising device for future high-density and low-power integrated systems. To enable design exploration of STT-MTJ, this paper presents a fully compact model for efficient SPICE simulation. Derived from the fundamental LLG equation, the new model consists of RC elements that are closed-form solutions of device geometry and material properties. They support transient SPICE simulations, providing necessary details beyond the macromodel. The accuracy is validated with numerical results and published data.
AB - STT-MTJ is a promising device for future high-density and low-power integrated systems. To enable design exploration of STT-MTJ, this paper presents a fully compact model for efficient SPICE simulation. Derived from the fundamental LLG equation, the new model consists of RC elements that are closed-form solutions of device geometry and material properties. They support transient SPICE simulations, providing necessary details beyond the macromodel. The accuracy is validated with numerical results and published data.
UR - http://www.scopus.com/inward/record.url?scp=84902158080&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84902158080&partnerID=8YFLogxK
U2 - 10.1109/ESSDERC.2013.6818887
DO - 10.1109/ESSDERC.2013.6818887
M3 - Conference contribution
AN - SCOPUS:84902158080
SN - 9781479906499
T3 - European Solid-State Device Research Conference
SP - 338
EP - 341
BT - ESSDERC 2013 - Proceedings of the 43rd European Solid-State Device Research Conference
PB - IEEE Computer Society
T2 - 43rd European Solid-State Device Research Conference, ESSDERC 2013
Y2 - 16 September 2013 through 20 September 2013
ER -