Compact modeling of signal transients and integrity analysis for dispersionless interconnect

Wei Zhao, Chi Liu, Wen Wu, Yong Ma, Xiaojin Zhao, Yu Cao, Guozeng Wang, Jin He

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

In this paper, a compact model for transient response of the dispersionless interconnects is rigorously derived with resistive, inductive and capacitive load terminations. The proposed compact models are verified by the HSPICE simulation result to be highly accurate. And the analysis of signal integrity such as delay and noise for the dispersionless interconnect is also demonstrated by the mans of the developed compact model.

Original languageEnglish (US)
Title of host publicationTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Pages686-689
Number of pages4
StatePublished - Nov 23 2011
Externally publishedYes
EventNanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011 - Boston, MA, United States
Duration: Jun 13 2011Jun 16 2011

Publication series

NameTechnical Proceedings of the 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
Volume2

Other

OtherNanotechnology 2011: Electronics, Devices, Fabrication, MEMS, Fluidics and Computational - 2011 NSTI Nanotechnology Conference and Expo, NSTI-Nanotech 2011
CountryUnited States
CityBoston, MA
Period6/13/116/16/11

Keywords

  • Compact modeling
  • Dispersionless
  • Interconnect
  • Signal integrity and transmission line theory
  • Transients

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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