TY - JOUR
T1 - Communication
T2 - On the asymmetric growth behavior of intermetallic compound layers during extended reflow of Sn-Rich Alloy on Cu
AU - Yazzie, Kyle E.
AU - Topliff, Jonathan
AU - Chawla, Nikhilesh
N1 - Funding Information:
The authors are grateful for the financial support for this work from the National Science Foundation Division of Materials Research, Metals Division (Drs. Alan Ardell, Bruce MacDonald, Harsh Chopra, and Eric Taleff, Program Directors). The authors gratefully acknowledge the use of facilities within the Leroy Eyring Center for Solid State Science at Arizona State University.
PY - 2012/10
Y1 - 2012/10
N2 - When solder interconnects are fabricated, a Sn-based alloy is melted between two substrates with metallization layers, such as Cu or Ni. From the reaction between Sn and Cu, a Cu 6Sn 5 intermetallic compound (IMC) layer is formed at the solder/Cu interfaces. The morphology of the IMC layer greatly influences the mechanical behavior of the solder joint. Here, we report on the characterization of a novel, asymmetric growth behavior of IMC layers in Sn-3.9Ag-0.7Cu solder joints, based on gravity-induced spalling of the IMC.
AB - When solder interconnects are fabricated, a Sn-based alloy is melted between two substrates with metallization layers, such as Cu or Ni. From the reaction between Sn and Cu, a Cu 6Sn 5 intermetallic compound (IMC) layer is formed at the solder/Cu interfaces. The morphology of the IMC layer greatly influences the mechanical behavior of the solder joint. Here, we report on the characterization of a novel, asymmetric growth behavior of IMC layers in Sn-3.9Ag-0.7Cu solder joints, based on gravity-induced spalling of the IMC.
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U2 - 10.1007/s11661-012-1329-8
DO - 10.1007/s11661-012-1329-8
M3 - Article
AN - SCOPUS:84867234276
SN - 1073-5623
VL - 43
SP - 3442
EP - 3446
JO - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
JF - Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
IS - 10
ER -