Communication: On the asymmetric growth behavior of intermetallic compound layers during extended reflow of Sn-Rich Alloy on Cu

Kyle E. Yazzie, Jonathan Topliff, Nikhilesh Chawla

Research output: Contribution to journalArticlepeer-review

2 Scopus citations

Abstract

When solder interconnects are fabricated, a Sn-based alloy is melted between two substrates with metallization layers, such as Cu or Ni. From the reaction between Sn and Cu, a Cu 6Sn 5 intermetallic compound (IMC) layer is formed at the solder/Cu interfaces. The morphology of the IMC layer greatly influences the mechanical behavior of the solder joint. Here, we report on the characterization of a novel, asymmetric growth behavior of IMC layers in Sn-3.9Ag-0.7Cu solder joints, based on gravity-induced spalling of the IMC.

Original languageEnglish (US)
Pages (from-to)3442-3446
Number of pages5
JournalMetallurgical and Materials Transactions A: Physical Metallurgy and Materials Science
Volume43
Issue number10
DOIs
StatePublished - Oct 1 2012

ASJC Scopus subject areas

  • Condensed Matter Physics
  • Mechanics of Materials
  • Metals and Alloys

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