Co-simulation of hardware RTL and software system using FMI

Masudul H. Quraishi, Hessam Sarjoughian, Soroosh Gholami

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Software-hardware co-design enabled with co-simulation is useful for building embedded computing systems. Indispensable to design is developing hardware and software simulation models at appropriate abstraction levels. Toward this goal, this paper presents a study of combined Register-Transfer-Level (RTL) and software system modeling. Specifically, composition of hardware and software models is proposed and a co-simulation environment to simulate the models is developed. The hardware and software parts of a prototypical Network on Chip (NoC) system are modeled and simulated. The hardware part is specified at RTL level using the DEVS Suite Simulator and the software part defined as a MATLAB script. A Functional Mock-up Interface (FMI) is developed for the DEVS-Suite Simulator to support hardware and software model coupling and co-simulation. This study details a modular development of hardware and software models executing on disparate environments instead of employing a monolithic modeling method supported with a monolithic simulation engine.

Original languageEnglish (US)
Title of host publicationWSC 2018 - 2018 Winter Simulation Conference
Subtitle of host publicationSimulation for a Noble Cause
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages572-583
Number of pages12
ISBN (Electronic)9781538665725
DOIs
StatePublished - Jan 31 2019
Event2018 Winter Simulation Conference, WSC 2018 - Gothenburg, Sweden
Duration: Dec 9 2018Dec 12 2018

Publication series

NameProceedings - Winter Simulation Conference
Volume2018-December
ISSN (Print)0891-7736

Conference

Conference2018 Winter Simulation Conference, WSC 2018
CountrySweden
CityGothenburg
Period12/9/1812/12/18

Fingerprint

Co-simulation
Software System
Hardware
Software
Simulator
Hardware/software Co-design
Simulators
Simulation Environment
Modeling Method
System Modeling
Model
MATLAB
Simulation Model
Engine
Engines
Computing
Chemical analysis
Simulation

ASJC Scopus subject areas

  • Software
  • Modeling and Simulation
  • Computer Science Applications

Cite this

Quraishi, M. H., Sarjoughian, H., & Gholami, S. (2019). Co-simulation of hardware RTL and software system using FMI. In WSC 2018 - 2018 Winter Simulation Conference: Simulation for a Noble Cause (pp. 572-583). [8632395] (Proceedings - Winter Simulation Conference; Vol. 2018-December). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/WSC.2018.8632395

Co-simulation of hardware RTL and software system using FMI. / Quraishi, Masudul H.; Sarjoughian, Hessam; Gholami, Soroosh.

WSC 2018 - 2018 Winter Simulation Conference: Simulation for a Noble Cause. Institute of Electrical and Electronics Engineers Inc., 2019. p. 572-583 8632395 (Proceedings - Winter Simulation Conference; Vol. 2018-December).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Quraishi, MH, Sarjoughian, H & Gholami, S 2019, Co-simulation of hardware RTL and software system using FMI. in WSC 2018 - 2018 Winter Simulation Conference: Simulation for a Noble Cause., 8632395, Proceedings - Winter Simulation Conference, vol. 2018-December, Institute of Electrical and Electronics Engineers Inc., pp. 572-583, 2018 Winter Simulation Conference, WSC 2018, Gothenburg, Sweden, 12/9/18. https://doi.org/10.1109/WSC.2018.8632395
Quraishi MH, Sarjoughian H, Gholami S. Co-simulation of hardware RTL and software system using FMI. In WSC 2018 - 2018 Winter Simulation Conference: Simulation for a Noble Cause. Institute of Electrical and Electronics Engineers Inc. 2019. p. 572-583. 8632395. (Proceedings - Winter Simulation Conference). https://doi.org/10.1109/WSC.2018.8632395
Quraishi, Masudul H. ; Sarjoughian, Hessam ; Gholami, Soroosh. / Co-simulation of hardware RTL and software system using FMI. WSC 2018 - 2018 Winter Simulation Conference: Simulation for a Noble Cause. Institute of Electrical and Electronics Engineers Inc., 2019. pp. 572-583 (Proceedings - Winter Simulation Conference).
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