Chip-to-Package Connection Scheme Based on Programmable Metallization Cell Technology

Michael Kozicki (Inventor)

Research output: Patent

Abstract

Sponsor obligation - no marketing
Original languageEnglish (US)
StatePublished - Sep 24 2001

Fingerprint

Dive into the research topics of 'Chip-to-Package Connection Scheme Based on Programmable Metallization Cell Technology'. Together they form a unique fingerprint.
View full fingerprint

Cite this