Chip-to-Package Connection Scheme Based on Programmable Metallization Cell Technology

Michael Kozicki (Inventor)

Research output: Patent

Abstract

Sponsor obligation - no marketing
Original languageEnglish (US)
StatePublished - Sep 24 2001

Fingerprint

Metallizing
Marketing

Cite this

@misc{ba626c2abf454dfdbc8cd5b3974ae2ac,
title = "Chip-to-Package Connection Scheme Based on Programmable Metallization Cell Technology",
abstract = "Sponsor obligation - no marketing",
author = "Michael Kozicki",
year = "2001",
month = "9",
day = "24",
language = "English (US)",
type = "Patent",

}

TY - PAT

T1 - Chip-to-Package Connection Scheme Based on Programmable Metallization Cell Technology

AU - Kozicki, Michael

PY - 2001/9/24

Y1 - 2001/9/24

N2 - Sponsor obligation - no marketing

AB - Sponsor obligation - no marketing

M3 - Patent

ER -