TY - GEN
T1 - Characterizing the role of deformation during electrochemical etching of metallic films
AU - Kumar, Anil
AU - Hsu, Keng
AU - Jacobs, Kyle
AU - Ferreira, Placid
AU - Fang, Nicholas X.
N1 - Funding Information:
The authors would like to thank Dr. Andrew Cannon, Dr. Yan Wu, and Prof. William King for their help in deformation experiments. This work was carried out in part in the Frederick Seitz Materials Research Laboratory Central Facilities, University of Illinois, which are partially supported by the U.S. Department of Energy under grants DE-FG02-07ER46453 and DE-FG02-07ER46471
PY - 2011
Y1 - 2011
N2 - Electrochemical dissolution of ionic species into a solid is an area of great interest in several fields including nanoscale patterning and energy storage. Such dissolution is strongly influenced by several factors e.g., work function difference, dislocation density, grain size, and number of grain boundaries. These parameters are strongly influenced by mechanical deformation of the ionic conductor. Here we characterize such a system of silver (Ag) and silver sulfide (Ag2S), where incorporation of Ag into the solid ionic conductor, Ag2S, is dramatically influenced by mechanical deformation. We show more than three-fold dissolution rate enhancement when the polycrystalline conductor is compressed to one-third of its original size. We attribute this enhancement to increased dislocation density which is supported by the high current densities observed during dissolution. Additionally, reduced electronic currents suggest most of this contribution comes from increased reaction at the metal-conductor interface. Our studies have important applications in areas involving ionic transport including direct metal patterning and energy storage technology.
AB - Electrochemical dissolution of ionic species into a solid is an area of great interest in several fields including nanoscale patterning and energy storage. Such dissolution is strongly influenced by several factors e.g., work function difference, dislocation density, grain size, and number of grain boundaries. These parameters are strongly influenced by mechanical deformation of the ionic conductor. Here we characterize such a system of silver (Ag) and silver sulfide (Ag2S), where incorporation of Ag into the solid ionic conductor, Ag2S, is dramatically influenced by mechanical deformation. We show more than three-fold dissolution rate enhancement when the polycrystalline conductor is compressed to one-third of its original size. We attribute this enhancement to increased dislocation density which is supported by the high current densities observed during dissolution. Additionally, reduced electronic currents suggest most of this contribution comes from increased reaction at the metal-conductor interface. Our studies have important applications in areas involving ionic transport including direct metal patterning and energy storage technology.
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U2 - 10.1557/opl.2011.601
DO - 10.1557/opl.2011.601
M3 - Conference contribution
AN - SCOPUS:80053216864
SN - 9781605112749
T3 - Materials Research Society Symposium Proceedings
SP - 175
EP - 180
BT - Deformation Mechanisms, Microstructure Evolution and Mechanical Properties of Nanoscale Materials
T2 - 2010 MRS Fall Meeting
Y2 - 29 November 2010 through 3 December 2010
ER -