TY - GEN
T1 - Characterization of self-heating in high-mobility Ge FinFET pMOS devices
AU - Bury, E.
AU - Kaczer, B.
AU - Mitard, J.
AU - Collaert, N.
AU - Khatami, N. S.
AU - Aksamija, Z.
AU - Vasileska, Dragica
AU - Raleva, K.
AU - Witters, L.
AU - Hellings, G.
AU - Linten, D.
AU - Groeseneken, G.
AU - Thean, A.
N1 - Publisher Copyright:
© 2015 JSAP.
PY - 2015/8/25
Y1 - 2015/8/25
N2 - Based on physically-extended methodology, measurements and simulations show that implementing high-mobility materials and particularly alloys, such as a SiGe buffer for mobility enhancement in a Ge channel, can result in a 115% increase in self heating in the N7 node, compared to standard Si FinFETs.
AB - Based on physically-extended methodology, measurements and simulations show that implementing high-mobility materials and particularly alloys, such as a SiGe buffer for mobility enhancement in a Ge channel, can result in a 115% increase in self heating in the N7 node, compared to standard Si FinFETs.
UR - http://www.scopus.com/inward/record.url?scp=84951153648&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=84951153648&partnerID=8YFLogxK
U2 - 10.1109/VLSIT.2015.7223703
DO - 10.1109/VLSIT.2015.7223703
M3 - Conference contribution
AN - SCOPUS:84951153648
T3 - Digest of Technical Papers - Symposium on VLSI Technology
SP - T60-T61
BT - 2015 Symposium on VLSI Technology, VLSI Technology 2015 - Digest of Technical Papers
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - Symposium on VLSI Technology, VLSI Technology 2015
Y2 - 16 June 2015 through 18 June 2015
ER -