Characterization of interconnect coupling noise using in-situ delay-change curve measurements

Takashi Sato, Yu Cao, Dennis Sylvester, Chenming Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Scopus citations

Abstract

The delay-change curve (DCC) characterizes the variation the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25-μm test chip are presented showing good agreement with SPICE simulations.

Original languageEnglish (US)
Title of host publicationProceedings of the Annual IEEE International ASIC Conference and Exhibit
PublisherIEEE
Pages321-325
Number of pages5
StatePublished - 2000
Externally publishedYes
EventProceedings of the 13th Annual IEEE International ASIC/SOC Conference - Arlington, VA, USA
Duration: Sep 13 2000Sep 16 2000

Other

OtherProceedings of the 13th Annual IEEE International ASIC/SOC Conference
CityArlington, VA, USA
Period9/13/009/16/00

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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  • Cite this

    Sato, T., Cao, Y., Sylvester, D., & Hu, C. (2000). Characterization of interconnect coupling noise using in-situ delay-change curve measurements. In Proceedings of the Annual IEEE International ASIC Conference and Exhibit (pp. 321-325). IEEE.