Characterization of interconnect coupling noise using in-situ delay-change curve measurements

Takashi Sato, Yu Cao, Dennis Sylvester, Chenming Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

14 Citations (Scopus)

Abstract

The delay-change curve (DCC) characterizes the variation the interconnect delay due to coupling noise. This paper describes a set of novel models that relate the DCC to the coupling noise waveform. These models are targeted for use in the timing margin design and accurate experimental determination of sub-nanosecond coupling noise. The circuit structure, a set of measurements, the model equations, and the waveform extraction procedures are newly proposed. Evaluation results using a 0.25-μm test chip are presented showing good agreement with SPICE simulations.

Original languageEnglish (US)
Title of host publicationProceedings of the Annual IEEE International ASIC Conference and Exhibit
PublisherIEEE
Pages321-325
Number of pages5
StatePublished - 2000
Externally publishedYes
EventProceedings of the 13th Annual IEEE International ASIC/SOC Conference - Arlington, VA, USA
Duration: Sep 13 2000Sep 16 2000

Other

OtherProceedings of the 13th Annual IEEE International ASIC/SOC Conference
CityArlington, VA, USA
Period9/13/009/16/00

Fingerprint

SPICE
Networks (circuits)

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

Cite this

Sato, T., Cao, Y., Sylvester, D., & Hu, C. (2000). Characterization of interconnect coupling noise using in-situ delay-change curve measurements. In Proceedings of the Annual IEEE International ASIC Conference and Exhibit (pp. 321-325). IEEE.

Characterization of interconnect coupling noise using in-situ delay-change curve measurements. / Sato, Takashi; Cao, Yu; Sylvester, Dennis; Hu, Chenming.

Proceedings of the Annual IEEE International ASIC Conference and Exhibit. IEEE, 2000. p. 321-325.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Sato, T, Cao, Y, Sylvester, D & Hu, C 2000, Characterization of interconnect coupling noise using in-situ delay-change curve measurements. in Proceedings of the Annual IEEE International ASIC Conference and Exhibit. IEEE, pp. 321-325, Proceedings of the 13th Annual IEEE International ASIC/SOC Conference, Arlington, VA, USA, 9/13/00.
Sato T, Cao Y, Sylvester D, Hu C. Characterization of interconnect coupling noise using in-situ delay-change curve measurements. In Proceedings of the Annual IEEE International ASIC Conference and Exhibit. IEEE. 2000. p. 321-325
Sato, Takashi ; Cao, Yu ; Sylvester, Dennis ; Hu, Chenming. / Characterization of interconnect coupling noise using in-situ delay-change curve measurements. Proceedings of the Annual IEEE International ASIC Conference and Exhibit. IEEE, 2000. pp. 321-325
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