Characterization of encapsulated solar cells by X-ray topography

Xiaodong Meng, Michael Stuckelberger, Laura Ding, Bradley West, April Jeffries, Mariana Bertoni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules calls for a non-destructive method. In this paper, we demonstrate that transmission X-ray topography (XRT) can be used as an accurate method to evaluate bending feature of encapsulated wafers and present in detail the experimental methods from capturing diffraction data to the data analysis.

Original languageEnglish (US)
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781509056057
DOIs
StatePublished - May 25 2018
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: Jun 25 2017Jun 30 2017

Other

Other44th IEEE Photovoltaic Specialist Conference, PVSC 2017
CountryUnited States
CityWashington
Period6/25/176/30/17

Keywords

  • Diffraction
  • Lamination
  • Reliability
  • Silicon
  • Solar cell
  • X-ray topography

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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  • Cite this

    Meng, X., Stuckelberger, M., Ding, L., West, B., Jeffries, A., & Bertoni, M. (2018). Characterization of encapsulated solar cells by X-ray topography. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017 (pp. 1-4). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2017.8366277