Characterization of encapsulated solar cells by X-ray topography

Xiaodong Meng, Michael Stuckelberger, Laura Ding, Bradley West, April Jeffries, Mariana Bertoni

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules calls for a non-destructive method. In this paper, we demonstrate that transmission X-ray topography (XRT) can be used as an accurate method to evaluate bending feature of encapsulated wafers and present in detail the experimental methods from capturing diffraction data to the data analysis.

Original languageEnglish (US)
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-4
Number of pages4
ISBN (Electronic)9781509056057
DOIs
StatePublished - May 25 2018
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: Jun 25 2017Jun 30 2017

Other

Other44th IEEE Photovoltaic Specialist Conference, PVSC 2017
CountryUnited States
CityWashington
Period6/25/176/30/17

Fingerprint

Topography
Solar cells
X rays
Encapsulation
Gels
Diffraction
Defects
Temperature

Keywords

  • Diffraction
  • Lamination
  • Reliability
  • Silicon
  • Solar cell
  • X-ray topography

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

Cite this

Meng, X., Stuckelberger, M., Ding, L., West, B., Jeffries, A., & Bertoni, M. (2018). Characterization of encapsulated solar cells by X-ray topography. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017 (pp. 1-4). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2017.8366277

Characterization of encapsulated solar cells by X-ray topography. / Meng, Xiaodong; Stuckelberger, Michael; Ding, Laura; West, Bradley; Jeffries, April; Bertoni, Mariana.

2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. p. 1-4.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Meng, X, Stuckelberger, M, Ding, L, West, B, Jeffries, A & Bertoni, M 2018, Characterization of encapsulated solar cells by X-ray topography. in 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., pp. 1-4, 44th IEEE Photovoltaic Specialist Conference, PVSC 2017, Washington, United States, 6/25/17. https://doi.org/10.1109/PVSC.2017.8366277
Meng X, Stuckelberger M, Ding L, West B, Jeffries A, Bertoni M. Characterization of encapsulated solar cells by X-ray topography. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc. 2018. p. 1-4 https://doi.org/10.1109/PVSC.2017.8366277
Meng, Xiaodong ; Stuckelberger, Michael ; Ding, Laura ; West, Bradley ; Jeffries, April ; Bertoni, Mariana. / Characterization of encapsulated solar cells by X-ray topography. 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017. Institute of Electrical and Electronics Engineers Inc., 2018. pp. 1-4
@inproceedings{f1138a5a6f834d368e07ee14c12b5f17,
title = "Characterization of encapsulated solar cells by X-ray topography",
abstract = "Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules calls for a non-destructive method. In this paper, we demonstrate that transmission X-ray topography (XRT) can be used as an accurate method to evaluate bending feature of encapsulated wafers and present in detail the experimental methods from capturing diffraction data to the data analysis.",
keywords = "Diffraction, Lamination, Reliability, Silicon, Solar cell, X-ray topography",
author = "Xiaodong Meng and Michael Stuckelberger and Laura Ding and Bradley West and April Jeffries and Mariana Bertoni",
year = "2018",
month = "5",
day = "25",
doi = "10.1109/PVSC.2017.8366277",
language = "English (US)",
pages = "1--4",
booktitle = "2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017",
publisher = "Institute of Electrical and Electronics Engineers Inc.",

}

TY - GEN

T1 - Characterization of encapsulated solar cells by X-ray topography

AU - Meng, Xiaodong

AU - Stuckelberger, Michael

AU - Ding, Laura

AU - West, Bradley

AU - Jeffries, April

AU - Bertoni, Mariana

PY - 2018/5/25

Y1 - 2018/5/25

N2 - Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules calls for a non-destructive method. In this paper, we demonstrate that transmission X-ray topography (XRT) can be used as an accurate method to evaluate bending feature of encapsulated wafers and present in detail the experimental methods from capturing diffraction data to the data analysis.

AB - Solar panel's reliability studies focus mainly on the properties of the encapsulating such as gel content and transmittance, while ignoring the impact of encapsulation process on the solar cells themselves. The harsh lamination conditions apply high temperature and pressure on the wafers, which can induce increased stress, deformation and defects. The investigation of solar cells sealed inside modules calls for a non-destructive method. In this paper, we demonstrate that transmission X-ray topography (XRT) can be used as an accurate method to evaluate bending feature of encapsulated wafers and present in detail the experimental methods from capturing diffraction data to the data analysis.

KW - Diffraction

KW - Lamination

KW - Reliability

KW - Silicon

KW - Solar cell

KW - X-ray topography

UR - http://www.scopus.com/inward/record.url?scp=85048461623&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85048461623&partnerID=8YFLogxK

U2 - 10.1109/PVSC.2017.8366277

DO - 10.1109/PVSC.2017.8366277

M3 - Conference contribution

SP - 1

EP - 4

BT - 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017

PB - Institute of Electrical and Electronics Engineers Inc.

ER -