TY - GEN
T1 - Characterization of a high-Q in-liquid longitudinal-mode film bulk acoustic resonator for real-time in-situ monitoring of competitive protein adsorption
AU - Choi, Seokheun
AU - Xu, Wencheng
AU - Zhang, Xu
AU - Chae, Junseok
PY - 2010/6/1
Y1 - 2010/6/1
N2 - We report the characterization results of in-liquid longitudinal-mode FBAR (L-FBAR) for real-time in-situ monitoring of the Vroman effect, a competitive adsorption and exchange of proteins on a surface. The change of resonant frequency of the L-FBAR, -1.55 GHz, is a direct function of the proteins' molecular weight, and thus we monitor the resonant frequency shifts to estimate the adsorption and exchange behavior. A low molecular weight (LMW) protein, albumin, initially covers the surface and is displaced by a high molecular weight (HMW) protein, IgG; sequentially, the highest molecular weight protein, fibrinogen displaces IgG. However, the reverse sequence does not occur.
AB - We report the characterization results of in-liquid longitudinal-mode FBAR (L-FBAR) for real-time in-situ monitoring of the Vroman effect, a competitive adsorption and exchange of proteins on a surface. The change of resonant frequency of the L-FBAR, -1.55 GHz, is a direct function of the proteins' molecular weight, and thus we monitor the resonant frequency shifts to estimate the adsorption and exchange behavior. A low molecular weight (LMW) protein, albumin, initially covers the surface and is displaced by a high molecular weight (HMW) protein, IgG; sequentially, the highest molecular weight protein, fibrinogen displaces IgG. However, the reverse sequence does not occur.
UR - http://www.scopus.com/inward/record.url?scp=77952784753&partnerID=8YFLogxK
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U2 - 10.1109/MEMSYS.2010.5442302
DO - 10.1109/MEMSYS.2010.5442302
M3 - Conference contribution
AN - SCOPUS:77952784753
SN - 9781424457649
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 739
EP - 742
BT - MEMS 2010 - The 23rd IEEE International Conference on Micro Electro Mechanical Systems, Technical Digest
T2 - 23rd IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2010
Y2 - 24 January 2010 through 28 January 2010
ER -