Abstract

In this study, we have characterized the microstructure, resistivity, and dynamic deformation behavior of Cu/Ru/SiO2 and Cu/SiO2 samples under scratch loading conditions. Cu/Ru/SiO2 samples showed higher elastic recovery and hardness when compared to the Cu/SiO2 samples. In the case of Cu/Ru/SiO2 samples, Ru acts as a glue layer between the Cu and the SiO2 substrate providing both strength and toughness against dynamic loading. Hence, the critical load for delamination is higher for Cu/Ru/SiO2 samples compared to Cu/SiO2 samples. Our results show that Cu/Ru/SiO2 thin films present significant potential to be used in Cu metallization.

Original languageEnglish (US)
Pages (from-to)1085-1090
Number of pages6
JournalJournal of Materials Engineering and Performance
Volume22
Issue number4
DOIs
StatePublished - Apr 2013

Fingerprint

Metallizing
Multilayers
Adhesion
Glues
Delamination
Toughness
Loads (forces)
Hardness
Recovery
Thin films
Microstructure
Substrates

Keywords

  • advanced characterization
  • coatings
  • mechanical testing

ASJC Scopus subject areas

  • Materials Science(all)
  • Mechanics of Materials
  • Mechanical Engineering

Cite this

Characterization and adhesion in Cu/Ru/SiO2/Si multilayer nano-scale structure for Cu metallization. / Chawla, Nikhilesh; Venkatesh, S. H.; Singh, D. R P; Alford, Terry.

In: Journal of Materials Engineering and Performance, Vol. 22, No. 4, 04.2013, p. 1085-1090.

Research output: Contribution to journalArticle

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