Can systems extend to polymer? SoP architecture design and challenges

Ujjwal Gupta, Sankalp Jain, Umit Ogras

Research output: Chapter in Book/Report/Conference proceedingConference contribution

4 Scopus citations

Abstract

Mechanically flexible and conformal shaped electronics is gaining momentum in today's electronics ecosystem. Rapid progress at device and circuit levels are already underway, but researchers are yet to envision the system design in a flexible form. This paper introduces hybrid flexible systems, and coins the term System-on-Polymer (SoP) to combine the advantages of flexible electronics and traditional silicon technology. First, we formally define flexibility as a new design metric in addition to existing power, performance, and area metrics. Then, we present a novel optimization approach to place rigid components on to a flexible substrate while minimizing the loss in flexibility. We show that intuitive placement leads to as much as 5.7x loss in flexibility compared to the optimal placement. Finally, we discuss major challenges in the architecture and design of SoPs.

Original languageEnglish (US)
Title of host publicationProceedings - 28th IEEE International System on Chip Conference, SOCC 2015
EditorsThomas Buchner, Danella Zhao, Karan Bhatia, Ramalingam Sridhar
PublisherIEEE Computer Society
Pages203-208
Number of pages6
ISBN (Electronic)9781467390934
DOIs
StatePublished - Feb 12 2016
Event28th IEEE International System on Chip Conference, SOCC 2015 - Beijing, China
Duration: Sep 8 2015Sep 11 2015

Publication series

NameInternational System on Chip Conference
Volume2016-February
ISSN (Print)2164-1676
ISSN (Electronic)2164-1706

Other

Other28th IEEE International System on Chip Conference, SOCC 2015
CountryChina
CityBeijing
Period9/8/159/11/15

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Gupta, U., Jain, S., & Ogras, U. (2016). Can systems extend to polymer? SoP architecture design and challenges. In T. Buchner, D. Zhao, K. Bhatia, & R. Sridhar (Eds.), Proceedings - 28th IEEE International System on Chip Conference, SOCC 2015 (pp. 203-208). [7406946] (International System on Chip Conference; Vol. 2016-February). IEEE Computer Society. https://doi.org/10.1109/SOCC.2015.7406946