Abstract
Crack-free, up to 2.8 μm thick GaN-based light emitting diodes were grown by metalorganic chemical vapor deposition on 2-inch Si(111) substrates. Elimination of cracks was achieved by using two ∼12 nm thick low-temperature AlN:Si interlayers for stress reduction. A significant enhancement in optical output power was obtained by an in situ insertion of a SixNy mask. Transmission electron microscopy measurements showed a tenfold reduction in dislocation density to ∼109 cm-2 by the low-temperature AlN and SixNy interlayers, resulting in a significant increase in luminescence intensity. Vertically contacted diodes showed a light output power of 152 μW at a current of 20 mA and a wavelength of 455 nm. Turn-on voltages around 2.8 V and series resistances of 55 Ω were obtained.
Original language | English (US) |
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Pages (from-to) | 308-313 |
Number of pages | 6 |
Journal | Physica Status Solidi (A) Applied Research |
Volume | 192 |
Issue number | 2 |
DOIs | |
State | Published - Aug 2002 |
Event | 4th International Symposium on Blue Lasers and Light Emitting Diodes (ISBLLED-2002) - Cordoba, Spain Duration: Mar 11 2002 → Mar 15 2002 |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Condensed Matter Physics