TY - GEN
T1 - Bonding strength and microstructure of snAg-based solid liquid interdiffusion bonds
AU - Ladani, Leila J.
AU - Razmi, Jafar
N1 - Funding Information:
This study was supported by Ferdowsi University of Mashhad.
PY - 2010
Y1 - 2010
N2 - Solid Liquid Inter-diffusion (SLID) is a new technology used as interconnects in high density and 3 dimensional packages. This manuscript investigates effect of process parameters, pressure, time and temperature on the strength of bonds and microstructure produced using this technology. A full factorial experiment is designed and implemented on the process with these 3 variables at 3 levels using Sn3.5Ag. Bonds' strength were then measured using a micro-tester and load displacements were monitored. This analysis shows that SLID bonds form at temperatures much higher than melting temperature of the low melting material. It also shows that time is a significant factor. Bonds that are formed under 10 minutes of time do not show a significant amount of intermetallics. Although the elemental percentage of copper is high in the middle of the bond, it does not reach enough to form any of intermetallic compounds of this ternary system. The specimens fabricated under longer time around 1 hour showed a more brittle, intermetallic like behavior.
AB - Solid Liquid Inter-diffusion (SLID) is a new technology used as interconnects in high density and 3 dimensional packages. This manuscript investigates effect of process parameters, pressure, time and temperature on the strength of bonds and microstructure produced using this technology. A full factorial experiment is designed and implemented on the process with these 3 variables at 3 levels using Sn3.5Ag. Bonds' strength were then measured using a micro-tester and load displacements were monitored. This analysis shows that SLID bonds form at temperatures much higher than melting temperature of the low melting material. It also shows that time is a significant factor. Bonds that are formed under 10 minutes of time do not show a significant amount of intermetallics. Although the elemental percentage of copper is high in the middle of the bond, it does not reach enough to form any of intermetallic compounds of this ternary system. The specimens fabricated under longer time around 1 hour showed a more brittle, intermetallic like behavior.
KW - Intermetallics
KW - Sn-Ag-Cu ternary system
KW - Solid liquid inter-diffusion
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U2 - 10.1115/IMECE2009-11454
DO - 10.1115/IMECE2009-11454
M3 - Conference contribution
AN - SCOPUS:77954255986
SN - 9780791843789
T3 - ASME International Mechanical Engineering Congress and Exposition, Proceedings
SP - 107
EP - 111
BT - Proceedings of the ASME International Mechanical Engineering Congress and Exposition 2009, IMECE 2009
PB - American Society of Mechanical Engineers (ASME)
T2 - 2009 ASME International Mechanical Engineering Congress and Exposition, IMECE2009
Y2 - 13 November 2009 through 19 November 2009
ER -