AUTOMATED IC FABRICATION FOR VLSI.

J. M. Robertson; A. J. Walton

AUTOMATED IC FABRICATION FOR VLSI.

J. M. Robertson, A. J. Walton

Arizona State University

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

The task of producing IC's is formidable and the resources of the industry have been seriously extended to maintain existing production technology. However, the industry now faces new challenges in very large scale integration (VLSI) where there may be up to 10**6 devices on each chip and CAM offers the only production option. This paper considers the specific problems of applying CAM to VLSI circuit fabrication.

Original language	English (US)
Title of host publication	IEE Conference Publication
Publisher	IEE
Pages	75-78
Number of pages	4
Edition	243
ISBN (Print)	0852963033
State	Published - Dec 1 1984

Publication series

Name	IEE Conference Publication
Number	243

ASJC Scopus subject areas

Electrical and Electronic Engineering

Cite this

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title = "AUTOMATED IC FABRICATION FOR VLSI.",

abstract = "The task of producing IC's is formidable and the resources of the industry have been seriously extended to maintain existing production technology. However, the industry now faces new challenges in very large scale integration (VLSI) where there may be up to 10**6 devices on each chip and CAM offers the only production option. This paper considers the specific problems of applying CAM to VLSI circuit fabrication.",

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N2 - The task of producing IC's is formidable and the resources of the industry have been seriously extended to maintain existing production technology. However, the industry now faces new challenges in very large scale integration (VLSI) where there may be up to 10**6 devices on each chip and CAM offers the only production option. This paper considers the specific problems of applying CAM to VLSI circuit fabrication.

AB - The task of producing IC's is formidable and the resources of the industry have been seriously extended to maintain existing production technology. However, the industry now faces new challenges in very large scale integration (VLSI) where there may be up to 10**6 devices on each chip and CAM offers the only production option. This paper considers the specific problems of applying CAM to VLSI circuit fabrication.

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AUTOMATED IC FABRICATION FOR VLSI.

Abstract

Publication series

ASJC Scopus subject areas

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