The task of producing IC's is formidable and the resources of the industry have been seriously extended to maintain existing production technology. However, the industry now faces new challenges in very large scale integration (VLSI) where there may be up to 10**6 devices on each chip and CAM offers the only production option. This paper considers the specific problems of applying CAM to VLSI circuit fabrication.
|Original language||English (US)|
|Title of host publication||IEE Conference Publication|
|Number of pages||4|
|State||Published - Dec 1 1984|
|Name||IEE Conference Publication|
ASJC Scopus subject areas
- Electrical and Electronic Engineering