TY - GEN
T1 - Automated design tool for examining microelectronic packaging design alternatives
AU - Chin, Siew Wei
AU - Rajan, Subramaniam D.
AU - Nagaraj, Ben K.
AU - Mahalingam, Mali
N1 - Publisher Copyright:
© 1993 American Society of Mechanical Engineers (ASME). All rights reserved.
PY - 1993
Y1 - 1993
N2 - Microelectronic packaging design issues have been given greater attention mainly because the performance, reliability and cost of semiconductor chips are increasingly dictated by the choice and design of the package. The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to other design alternatives. Two pcickaging design examples serve to illustrate the functionalities of the automated design optimization tool.
AB - Microelectronic packaging design issues have been given greater attention mainly because the performance, reliability and cost of semiconductor chips are increasingly dictated by the choice and design of the package. The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to other design alternatives. Two pcickaging design examples serve to illustrate the functionalities of the automated design optimization tool.
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U2 - 10.1115/DETC1993-0080
DO - 10.1115/DETC1993-0080
M3 - Conference contribution
AN - SCOPUS:85104174321
T3 - Proceedings of the ASME Design Engineering Technical Conference
SP - 263
EP - 276
BT - 10th Biennial Conference on Reliability, Stress Analysis, and Failure Prevention
PB - American Society of Mechanical Engineers (ASME)
T2 - ASME 1993 Design Technical Conferences, DETC 1993
Y2 - 19 September 1993 through 22 September 1993
ER -