Automated design tool for examining microelectronic packaging design alternatives

Siew Wei Chin, Subramaniam Rajan, Ben K. Nagaraj, Mali Mahalingam

Research output: Contribution to journalArticle

4 Citations (Scopus)

Abstract

The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to the design alternatives.

Original languageEnglish (US)
Pages (from-to)76-82
Number of pages7
JournalIEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging
Volume17
Issue number1
DOIs
StatePublished - Feb 1994

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Microelectronics
Packaging
Nonlinear programming
Finite element method

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Automated design tool for examining microelectronic packaging design alternatives. / Chin, Siew Wei; Rajan, Subramaniam; Nagaraj, Ben K.; Mahalingam, Mali.

In: IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging, Vol. 17, No. 1, 02.1994, p. 76-82.

Research output: Contribution to journalArticle

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