Automated design tool for examining microelectronic packaging design alternatives

Siew Wei Chin, Subramaniam Rajan, Ben K. Nagaraj, Mali Mahalingam

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Microelectronic packaging design Issues have been given greater attention mainly because the performance, reliability and cost of semiconductor chips are increasingly dictated by the choice and design of the package. The task of integrating the requirements imposed by different disciplines such as mechanical and thermal issues in an automated design tool, is discussed in this paper. Finite element analysis and nonlinear programming techniques are used in an iterative fashion to progress from an initial design concept to a design that satisfies all design requirements or one that is superior to other design alternatives. Two packaging design examples serve to illustrate the functionalities of the automated design optimization tool.

Original languageEnglish (US)
Title of host publicationReliability, Stress Analysis, and Failure Prevention
EditorsMo Shahinpoor, H.S. Tzou
PublisherPubl by ASME
Pages263-276
Number of pages14
ISBN (Print)0791811727
StatePublished - Dec 1 1993
Event14th Biennial Conference on Mechanical Vibration and Noise - Albuquerque, NM, USA
Duration: Sep 19 1993Sep 22 1993

Publication series

NameAmerican Society of Mechanical Engineers, Design Engineering Division (Publication) DE
Volume55

Other

Other14th Biennial Conference on Mechanical Vibration and Noise
CityAlbuquerque, NM, USA
Period9/19/939/22/93

ASJC Scopus subject areas

  • Engineering(all)

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