Atomistically-informed continuum modeling of damage mechanisms in radially-grown CNT nanocomposites

Karthik Rajan Venkatesan, Nithya Subramanian, Aditi Chattopadhyay

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A micromechanical modeling framework that integrates an interphase damage model is used to study damage evolution, and failure in radially-grown carbon nanotube (CNT) reinforced nanocomposites. The atomistically-informed damage model is developed using the continuum damage mechanics approach with damage evolution equations derived using molecular dynamics simulations. The developed damage model is integrated with a high-fidelity micromechanical analysis and captures the underlying physical behavior that could be attributed to the enhancement of the out-of-plane properties at the higher length scales. To illustrate the effects of nanoarchitecture, the response of the radially-grown CNT nanocomposite is compared with that of the traditional carbon fiber reinforced polymer (CFRP) composite.

Original languageEnglish (US)
Title of host publication33rd Technical Conference of the American Society for Composites 2018
PublisherDEStech Publications Inc.
Pages1941-1957
Number of pages17
Volume3
ISBN (Electronic)9781510872073
StatePublished - Jan 1 2018
Event33rd Technical Conference of the American Society for Composites 2018 - Seattle, United States
Duration: Sep 24 2018Sep 27 2018

Other

Other33rd Technical Conference of the American Society for Composites 2018
CountryUnited States
CitySeattle
Period9/24/189/27/18

    Fingerprint

Keywords

  • Carbon nanotubes
  • Damage mechanics
  • Multiscale modeling

ASJC Scopus subject areas

  • Mechanics of Materials
  • Surfaces, Coatings and Films
  • Metals and Alloys

Cite this

Venkatesan, K. R., Subramanian, N., & Chattopadhyay, A. (2018). Atomistically-informed continuum modeling of damage mechanisms in radially-grown CNT nanocomposites. In 33rd Technical Conference of the American Society for Composites 2018 (Vol. 3, pp. 1941-1957). DEStech Publications Inc..