Analysis of Ti-silicide formation with a thin Ta interlayer on Si (100)

Hyeongtag Jeon, Heykyoung Won, Yangdo Kim, Jaeseob Lee, Robert Nemanich

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The phase formation of Ti-silicide with a Ta interlayer deposited on Si (100) substrates has been studied. The Ti layer of 100 Å was deposited on top of a 5 Å Ta interlayer on a Si (100) substrate. After metal deposition, the Si substrate was in-situ annealed at temperatures between 580 and 830 °C. Ti-silicides were formed and analyzed with using X-ray diffractometer (XRD), scanning electron microscope (SEM), Auger electron spectroscopy (AES), and transmission electron microscope (TEM) to verify the phase transition and the surface and interface morphologies. The change in the temperature of the phase transition from C49 to C54 TiSi2 was observed. The C49 to C54 TiSi2 phase transition temperature was below 630 °C for the samples with the Ta interlayer and was about 830 °C for the samples without the Ta interlayer. The temperature of the phase transition from C49 to C54 TiSi2 with the Ta interlayer was observed to be lowered by about 200 °C. The AES data showed a 1:2 ratio of Ti:Si in the Ti-silicide layer and indicated that the Ta layer remained at the interface between TiSi2 and the Si (100) substrate. A retarded agglomeration of Ti-silicide was observed with the Ta interlayer. The present results for Ti-silicide with a Ta interlayer confirmed that the areal coverage and island morphologies of TiSi2 on Si (100) were uniform and smooth.

Original languageEnglish (US)
Pages (from-to)903-907
Number of pages5
JournalJournal of the Korean Physical Society
Issue number5
Publication statusPublished - May 2002
Externally publishedYes



  • Phase transition
  • Surface morphology
  • Ta interlayer
  • Ti-silicide

ASJC Scopus subject areas

  • Physics and Astronomy(all)

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