Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance

R. W. Techentin, G. T. Lei, A. J. Staniszewski, George Pan, D. J. Schwab, B. K. Gilbert

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.

Original languageEnglish (US)
Title of host publicationCPEM Digest (Conference on Precision Electromagnetic Measurements)
PublisherIEEE
Pages142
Number of pages1
StatePublished - 1994
Externally publishedYes
EventProceedings of the 1994 Conference on Precision Electromagnetic Measurements - Boulder, CO, USA
Duration: Jun 27 1994Jul 1 1994

Other

OtherProceedings of the 1994 Conference on Precision Electromagnetic Measurements
CityBoulder, CO, USA
Period6/27/947/1/94

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Instrumentation

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  • Cite this

    Techentin, R. W., Lei, G. T., Staniszewski, A. J., Pan, G., Schwab, D. J., & Gilbert, B. K. (1994). Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards: Simulation and measurement of power plane noise and internal inductance. In CPEM Digest (Conference on Precision Electromagnetic Measurements) (pp. 142). IEEE.