Abstract
High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.
| Original language | English (US) |
|---|---|
| Title of host publication | CPEM Digest (Conference on Precision Electromagnetic Measurements) |
| Publisher | IEEE |
| Pages | 142 |
| Number of pages | 1 |
| State | Published - 1994 |
| Externally published | Yes |
| Event | Proceedings of the 1994 Conference on Precision Electromagnetic Measurements - Boulder, CO, USA Duration: Jun 27 1994 → Jul 1 1994 |
Other
| Other | Proceedings of the 1994 Conference on Precision Electromagnetic Measurements |
|---|---|
| City | Boulder, CO, USA |
| Period | 6/27/94 → 7/1/94 |
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ASJC Scopus subject areas
- Electrical and Electronic Engineering
- Instrumentation
Cite this
Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards : Simulation and measurement of power plane noise and internal inductance. / Techentin, R. W.; Lei, G. T.; Staniszewski, A. J.; Pan, George; Schwab, D. J.; Gilbert, B. K.
CPEM Digest (Conference on Precision Electromagnetic Measurements). IEEE, 1994. p. 142.Research output: Chapter in Book/Report/Conference proceeding › Conference contribution
}
TY - GEN
T1 - Analysis of heretofor unsolved electromagnetic simulation problems in high performance multichip modules and printed circuit boards
T2 - Simulation and measurement of power plane noise and internal inductance
AU - Techentin, R. W.
AU - Lei, G. T.
AU - Staniszewski, A. J.
AU - Pan, George
AU - Schwab, D. J.
AU - Gilbert, B. K.
PY - 1994
Y1 - 1994
N2 - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.
AB - High performance multichip modules and printed circuit boards are often characterized by power plane noise and internal inductance which tend to result in reduced circuit efficiency. Therefore, it is necessary to model the different factors that give rise to this phenomenon. These includes the mutual inductance of return and ground currents, the instability of the ground plane potential and the reflection noise. The paper presents new algorithms and modeling techniques for solving these problems.
UR - http://www.scopus.com/inward/record.url?scp=0028564393&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=0028564393&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:0028564393
SP - 142
BT - CPEM Digest (Conference on Precision Electromagnetic Measurements)
PB - IEEE
ER -