Analysis and mitigation of electromigration in RF Circuits: An LNA case study

Ramachandran Venkatasubramanian, Doohwang Chang, Sule Ozev

Research output: Chapter in Book/Report/Conference proceedingConference contribution

3 Scopus citations

Abstract

Circuit reliability is an increasingly important concern. Most of the reliability studies have concentrated on digital circuits, which have typically led analog circuits in terms of technology node. This is no longer true as both RF/analog and digital components are being integrated with the leading edge manufacturing process. In this paper, we present a methodology for analyzing the parametric degradation caused by electro migration in inductors and vias at design time. We identify reliability hot spots and concentrate our efforts on these circuit components to enhance the lifetime of the circuit with low area and no performance impact.

Original languageEnglish (US)
Title of host publicationProceedings - 16th IEEE European Test Symposium, ETS 2011
Number of pages1
DOIs
StatePublished - Aug 29 2011
Event16th IEEE European Test Symposium, ETS 2011 - Trondheim, Norway
Duration: May 23 2011May 27 2011

Publication series

NameProceedings - 16th IEEE European Test Symposium, ETS 2011

Other

Other16th IEEE European Test Symposium, ETS 2011
CountryNorway
CityTrondheim
Period5/23/115/27/11

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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    Venkatasubramanian, R., Chang, D., & Ozev, S. (2011). Analysis and mitigation of electromigration in RF Circuits: An LNA case study. In Proceedings - 16th IEEE European Test Symposium, ETS 2011 [5957961] (Proceedings - 16th IEEE European Test Symposium, ETS 2011). https://doi.org/10.1109/ETS.2011.50