Abstract
This article presents a novel approach to model the mechanical response of smart polymeric materials. A cyclobutane-based mechanophore, named "smart particle" in this article, is embedded in an epoxy polymer matrix to form the self-sensing smart material. A spring-bead model is developed based on the results from molecular dynamics simulation at the nanoscale to represent bond clusters of a smart polymer. The spring-bead network model is developed through parametric studies and mechanical equivalence optimization to represent the microstructure of the material. A statistical network model is introduced, which is capable of bridging the high-accuracy molecular dynamics model at the nanoscale and the computationally efficient finite element model at the macroscale. A comparison between experimental and simulation results shows that the multiscale model can capture global mechanical response and local material properties.
Original language | English (US) |
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Pages (from-to) | 1461-1475 |
Number of pages | 15 |
Journal | Journal of Intelligent Material Systems and Structures |
Volume | 27 |
Issue number | 11 |
DOIs | |
State | Published - Jul 1 2016 |
Keywords
- Multiscale modeling
- molecular dynamics
- optimization
- spring-bead-based network model
ASJC Scopus subject areas
- General Materials Science
- Mechanical Engineering