An inorganic approach to wet-chemical fabrication of 3rd generation tandem cells

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Original languageEnglish (US)
Title of host publication2006 International Conference on Electronic Materials and Packaging, EMAP
DOIs
StatePublished - Dec 1 2006
Externally publishedYes
Event2006 International Conference on Electronic Materials and Packaging, EMAP - Kowloon, China
Duration: Dec 11 2006Dec 14 2006

Publication series

Name2006 International Conference on Electronic Materials and Packaging, EMAP

Other

Other2006 International Conference on Electronic Materials and Packaging, EMAP
CountryChina
CityKowloon
Period12/11/0612/14/06

ASJC Scopus subject areas

  • Electrical and Electronic Engineering

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