Abstract
A high-sensitivity, low-noise in-plane capacitive micro-accelerometer utilizing a combined bulk and surface micromachining technology is demonstrated. The accelerometer utilizes a 0.5mm-thick, 2.4mm×1.0mm proofmass and high aspect-ratio vertical polysilicon sensing electrodes fabricated using a trench refill process. The electrodes are separated from the proof-mass through a 1.1μm sensing gap that is formed using a sacrificial oxide layer. The measured sensitivity of the device is 5.6pF/g and the output noise floor of the accelerometer hybrid assembled with CMOS interface circuit is 1.6μg/√Hz in atmosphere.
| Original language | English (US) |
|---|---|
| Title of host publication | Proceedings of the IEEE Micro Electro Mechanical Systems (MEMS) |
| Pages | 466-469 |
| Number of pages | 4 |
| State | Published - 2003 |
| Externally published | Yes |
| Event | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems - Kyoto, Japan Duration: Jan 19 2003 → Jan 23 2003 |
Other
| Other | IEEE Sixteenth Annual International Conference on Micro Electro Mechanical Systems |
|---|---|
| Country/Territory | Japan |
| City | Kyoto |
| Period | 1/19/03 → 1/23/03 |
Keywords
- μg accelerometer
- Inertial sensors
- Sigma-delta
ASJC Scopus subject areas
- Mechanical Engineering
- Electrical and Electronic Engineering
- Control and Systems Engineering