Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys

K. Mysore, D. Chan, D. Bhate, G. Subbarayan, I. Dutta, V. Gupta, J. Zhao, D. Edwards

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

Predicting reliability of solder joints requires a thorough understanding of solder constitutive behavior. Recent studies on SnAgCu solder alloys have reported that pre-test conditions of aging-time and aging-temperatures can be factors that significantly affect solder constitutive behavior. The results presented here are a part of ongoing efforts to construct constitutive models that can predict aging affects on behavior of SnAgCu solder alloys. In this work, creep test results on aged Sn3.8Ag0.7Cu samples are reported, and aging effects are discussed primarily on secondary creep behavior and on microstructure. Aging effects on primary creep are observed, and will be discussed, and modeled in a future work. Experiments to characterize behavior were carried out using double-lap shear tests on specimens specifically prepared to represent realistic microstructures, and mitigate effects of joint geometry, and stress heterogeneity during test conditions. Aging temperatures of -10°C, 25°C, 75°C and 125°C, and aging times of 15, 30, 60 and 90 days (at each aging temperature) were selected as different levels of factors in a statistically designed experiment. Previous studies have focused on developing constitutive models without due considerations to aging effects, the results presented herein augment aging-informed constitutive model development efforts that are currently in progress.

Original languageEnglish (US)
Title of host publication2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
Pages870-875
Number of pages6
DOIs
StatePublished - Sep 9 2008
Externally publishedYes
Event2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM - Orlando,FL, United States
Duration: May 28 2008May 31 2008

Publication series

Name2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM

Other

Other2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM
CountryUnited States
CityOrlando,FL
Period5/28/085/31/08

Keywords

  • Aging
  • Anand model
  • Lead-free solders
  • Primary creep

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

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    Mysore, K., Chan, D., Bhate, D., Subbarayan, G., Dutta, I., Gupta, V., Zhao, J., & Edwards, D. (2008). Aging-informed behavior of Sn3.8Ag0.7Cu solder alloys. In 2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM (pp. 870-875). [4544357] (2008 11th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, I-THERM). https://doi.org/10.1109/ITHERM.2008.4544357