Advanced multichip module packaging and interconnect issues for GaAs signal processors operating above 1 GHz clock rates

B. Gilbert, R. Thompson, G. Fokken, W. McNeff, J. Prentice, D. Rowlands, A. Staniszewski, W. Walters, S. Zahn, George Pan

Research output: Chapter in Book/Report/Conference proceedingConference contribution

6 Scopus citations

Abstract

Only a single performance parameter has so far eluded the CMOS technology, that of high clock rate. As a result, for those applications in which system clock rates above approximately 50-100 MHz are important, two alternate technologies, silicon bipolar ECL, and, to a lesser extent, the various forms of Gallium Arsenide technology, fulfill important niches in the computer and signal processor environment. The topics discussed are multichip modules, ICs for high clock rate applications, connection methods for fast chips, termination and decoupling on multichip modules (MCM), power and wideband signal connection to the MCM; thermal environment of high clock rare MCMs, MCMs operating at high clock rates, and electromagnetic modeling.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsAlfred P. DeFonzo, Gnanalingam Arjavalingam, James Pazaris
PublisherPubl by Int Soc for Optical Engineering
Pages235-248
Number of pages14
Volume1390
Editionpt 2
StatePublished - 1991
Externally publishedYes
EventInternational Symposium on Advances in Interconnection and Packaging - Boston, MA, USA
Duration: Nov 5 1990Nov 9 1990

Other

OtherInternational Symposium on Advances in Interconnection and Packaging
CityBoston, MA, USA
Period11/5/9011/9/90

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Condensed Matter Physics

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