Adhesion of arbitrary-shaped thin-film microstructures

Dhruv Bhate, M. Dunn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Microsystems present several challenging reliability-related issues on account of their micron-scale dimensions. Many of these micron sized devices consist of compliant beam- or plate-like microstructures that are in close proximity to a substrate or other structural parts. If such structures come into contact, short-range adhesive forces can pin them together if they cannot be overcome by the elastic restoring forces of the deformed microstructures. This phenomenon of adhesion, often called stiction, depends on the structural response of the microstructure itself, as well as on the nature of the adhesive forces between the contacting surfaces. In this study we develop an approach to model adhesion in microsystems in a computationally feasible finite element environment, and demonstrate its capability via a companion experimental study. The modeling approach adopts the principles of three dimensional linear elastic fracture mechanics (LEFM) and extends it to thin-film plate-like microstructures. Extensive experimental work is done to study the behavior of adhesion in microstructure cantilever beams and square and circular plates. The finite element code is validated against analytically predicted and experimentally observed behavior to corroborate its effectiveness.

Original languageEnglish (US)
Title of host publication7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Volume2006
DOIs
StatePublished - Dec 1 2006
Externally publishedYes
Event7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 - Como, Italy
Duration: Apr 24 2006Apr 26 2006

Other

Other7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
CountryItaly
CityComo
Period4/24/064/26/06

Fingerprint

Adhesion
Thin films
Microstructure
Microsystems
Adhesives
Stiction
Cantilever beams
Fracture mechanics
Substrates

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Bhate, D., & Dunn, M. (2006). Adhesion of arbitrary-shaped thin-film microstructures. In 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 (Vol. 2006). [1643993] https://doi.org/10.1109/ESIME.2006.1643993

Adhesion of arbitrary-shaped thin-film microstructures. / Bhate, Dhruv; Dunn, M.

7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006 2006. 1643993.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Bhate, D & Dunn, M 2006, Adhesion of arbitrary-shaped thin-film microstructures. in 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. vol. 2006, 1643993, 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006, Como, Italy, 4/24/06. https://doi.org/10.1109/ESIME.2006.1643993
Bhate D, Dunn M. Adhesion of arbitrary-shaped thin-film microstructures. In 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006. 2006. 1643993 https://doi.org/10.1109/ESIME.2006.1643993
Bhate, Dhruv ; Dunn, M. / Adhesion of arbitrary-shaped thin-film microstructures. 7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006. Vol. 2006 2006.
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