Adhesion of arbitrary-shaped thin-film microstructures

D. Bhate, M. Dunn

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Microsystems present several challenging reliability-related issues on account of their micron-scale dimensions. Many of these micron sized devices consist of compliant beam- or plate-like microstructures that are in close proximity to a substrate or other structural parts. If such structures come into contact, short-range adhesive forces can pin them together if they cannot be overcome by the elastic restoring forces of the deformed microstructures. This phenomenon of adhesion, often called stiction, depends on the structural response of the microstructure itself, as well as on the nature of the adhesive forces between the contacting surfaces. In this study we develop an approach to model adhesion in microsystems in a computationally feasible finite element environment, and demonstrate its capability via a companion experimental study. The modeling approach adopts the principles of three dimensional linear elastic fracture mechanics (LEFM) and extends it to thin-film plate-like microstructures. Extensive experimental work is done to study the behavior of adhesion in microstructure cantilever beams and square and circular plates. The finite element code is validated against analytically predicted and experimentally observed behavior to corroborate its effectiveness.

Original languageEnglish (US)
Title of host publication7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
DOIs
StatePublished - 2006
Externally publishedYes
Event7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006 - Como, Italy
Duration: Apr 24 2006Apr 26 2006

Publication series

Name7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
Volume2006

Other

Other7th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Micro-Electronics and Micro-Systems, EuroSimE 2006
CountryItaly
CityComo
Period4/24/064/26/06

ASJC Scopus subject areas

  • Engineering(all)

Fingerprint Dive into the research topics of 'Adhesion of arbitrary-shaped thin-film microstructures'. Together they form a unique fingerprint.

Cite this