Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules

Joseph Karas, Lynne Michaelson, Mariela Lizet Castillo, Krystal Munoz, Mark Bailly, Harsh Jain, Austin Akey, Jim Rand, Tom Tyson, Tonio Buonassisi, Stuart Bowden

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.

Original languageEnglish (US)
Title of host publication2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1-5
Number of pages5
ISBN (Electronic)9781509056057
DOIs
StatePublished - May 25 2018
Event44th IEEE Photovoltaic Specialist Conference, PVSC 2017 - Washington, United States
Duration: Jun 25 2017Jun 30 2017

Other

Other44th IEEE Photovoltaic Specialist Conference, PVSC 2017
CountryUnited States
CityWashington
Period6/25/176/30/17

ASJC Scopus subject areas

  • Renewable Energy, Sustainability and the Environment
  • Electrical and Electronic Engineering
  • Electronic, Optical and Magnetic Materials

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    Karas, J., Michaelson, L., Castillo, M. L., Munoz, K., Bailly, M., Jain, H., Akey, A., Rand, J., Tyson, T., Buonassisi, T., & Bowden, S. (2018). Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules. In 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017 (pp. 1-5). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/PVSC.2017.8366149