TY - GEN
T1 - Addressing adhesion and reliability concerns of copper-plated c-Si solar cells and modules
AU - Karas, Joseph
AU - Michaelson, Lynne
AU - Castillo, Mariela Lizet
AU - Munoz, Krystal
AU - Bailly, Mark
AU - Jain, Harsh
AU - Akey, Austin
AU - Rand, Jim
AU - Tyson, Tom
AU - Buonassisi, Tonio
AU - Bowden, Stuart
N1 - Publisher Copyright:
© 2017 IEEE.
PY - 2017
Y1 - 2017
N2 - Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.
AB - Copper-plated contacts for front side crystalline silicon solar cells are a topic of considerable interest, with many recent publications presenting a variety of successful methods and impressive cell results. Several of the more obvious challenges yet to be proven relate to the durability and reliability of plated contacts, especially the adhesion of plated metal to solar cells and the long-term stability of the metals that could potentially result in gradual power degradation. In this work, we have fabricated copper plated cells using several different front side patterning methods. For a resist-based process, we have optimized plated cell processing to achieve adhesion comparable to screenprinted silver paste contacts. For laser-based patterning methods, greater understanding of the metal-silicon interface and microstructure effecting adhesion is still needed.
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U2 - 10.1109/PVSC.2017.8366149
DO - 10.1109/PVSC.2017.8366149
M3 - Conference contribution
AN - SCOPUS:85048482028
T3 - 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
SP - 1567
EP - 1572
BT - 2017 IEEE 44th Photovoltaic Specialist Conference, PVSC 2017
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 44th IEEE Photovoltaic Specialist Conference, PVSC 2017
Y2 - 25 June 2017 through 30 June 2017
ER -