Additively manufactured impinging air jet cooler for high-power electronic devices

Beomjin Kwon, Thomas Foulkes, Tianyu Yang, Nenad Miljkovic, William P. King

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

We report an air jet cooler made with additive manufacturing. The air jet cooler directs an impinging air jet directly onto electronic devices. The jet system was fabricated by a single manufacturing process using a resin-based three-dimensional printer, and monolithically integrates two nozzles, air delivery channel, flow distributor and mechanical fixtures within a volume of 80x80x80 mm3. To demonstrate the viability of the jet cooler, high power gallium nitride (GaN) transistors were cooled using air jets at up to 195 m/sec. With the air jet, a GaN transistor could dissipate heat flux up to 60 W/cm2, which was 7X larger than the maximum allowable heat flux under natural convection cooling. The air jet cooler is also capable of rapid switching of the cooling air. Direct impingement of air jet could reduce the GaN transistor temperature by ~70°C within 11 seconds. This work demonstrates the potential of additively manufactured air jet coolers as a compact thermal management scheme for high-power electronics. Since the geometry of the air jet coolers can be easily tailored to various shapes, the demonstrated concept can be applied for cooling a variety of electronics with different topologies and different layouts of hot spots.

Original languageEnglish (US)
Title of host publicationProceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
PublisherIEEE Computer Society
Pages941-945
Number of pages5
ISBN (Electronic)9781728124612
DOIs
StatePublished - May 2019
Event18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 - Las Vegas, United States
Duration: May 28 2019May 31 2019

Publication series

NameInterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM
Volume2019-May
ISSN (Print)1936-3958

Conference

Conference18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019
CountryUnited States
CityLas Vegas
Period5/28/195/31/19

Fingerprint

Power electronics
Air
Gallium nitride
Transistors
Cooling
Heat flux
3D printers
Channel flow
Natural convection
Temperature control
Nozzles
Electronic equipment
Resins
Topology
Geometry

Keywords

  • Additive manufacturing
  • Convection cooling
  • High-power electronics
  • Impinging air jet
  • Jet nozzle

ASJC Scopus subject areas

  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Kwon, B., Foulkes, T., Yang, T., Miljkovic, N., & King, W. P. (2019). Additively manufactured impinging air jet cooler for high-power electronic devices. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019 (pp. 941-945). [8757389] (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May). IEEE Computer Society. https://doi.org/10.1109/ITHERM.2019.08757389

Additively manufactured impinging air jet cooler for high-power electronic devices. / Kwon, Beomjin; Foulkes, Thomas; Yang, Tianyu; Miljkovic, Nenad; King, William P.

Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, 2019. p. 941-945 8757389 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM; Vol. 2019-May).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Kwon, B, Foulkes, T, Yang, T, Miljkovic, N & King, WP 2019, Additively manufactured impinging air jet cooler for high-power electronic devices. in Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019., 8757389, InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM, vol. 2019-May, IEEE Computer Society, pp. 941-945, 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019, Las Vegas, United States, 5/28/19. https://doi.org/10.1109/ITHERM.2019.08757389
Kwon B, Foulkes T, Yang T, Miljkovic N, King WP. Additively manufactured impinging air jet cooler for high-power electronic devices. In Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society. 2019. p. 941-945. 8757389. (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM). https://doi.org/10.1109/ITHERM.2019.08757389
Kwon, Beomjin ; Foulkes, Thomas ; Yang, Tianyu ; Miljkovic, Nenad ; King, William P. / Additively manufactured impinging air jet cooler for high-power electronic devices. Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019. IEEE Computer Society, 2019. pp. 941-945 (InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM).
@inproceedings{8334d845a137425e887776d4e73ad3ea,
title = "Additively manufactured impinging air jet cooler for high-power electronic devices",
abstract = "We report an air jet cooler made with additive manufacturing. The air jet cooler directs an impinging air jet directly onto electronic devices. The jet system was fabricated by a single manufacturing process using a resin-based three-dimensional printer, and monolithically integrates two nozzles, air delivery channel, flow distributor and mechanical fixtures within a volume of 80x80x80 mm3. To demonstrate the viability of the jet cooler, high power gallium nitride (GaN) transistors were cooled using air jets at up to 195 m/sec. With the air jet, a GaN transistor could dissipate heat flux up to 60 W/cm2, which was 7X larger than the maximum allowable heat flux under natural convection cooling. The air jet cooler is also capable of rapid switching of the cooling air. Direct impingement of air jet could reduce the GaN transistor temperature by ~70°C within 11 seconds. This work demonstrates the potential of additively manufactured air jet coolers as a compact thermal management scheme for high-power electronics. Since the geometry of the air jet coolers can be easily tailored to various shapes, the demonstrated concept can be applied for cooling a variety of electronics with different topologies and different layouts of hot spots.",
keywords = "Additive manufacturing, Convection cooling, High-power electronics, Impinging air jet, Jet nozzle",
author = "Beomjin Kwon and Thomas Foulkes and Tianyu Yang and Nenad Miljkovic and King, {William P.}",
year = "2019",
month = "5",
doi = "10.1109/ITHERM.2019.08757389",
language = "English (US)",
series = "InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM",
publisher = "IEEE Computer Society",
pages = "941--945",
booktitle = "Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019",

}

TY - GEN

T1 - Additively manufactured impinging air jet cooler for high-power electronic devices

AU - Kwon, Beomjin

AU - Foulkes, Thomas

AU - Yang, Tianyu

AU - Miljkovic, Nenad

AU - King, William P.

PY - 2019/5

Y1 - 2019/5

N2 - We report an air jet cooler made with additive manufacturing. The air jet cooler directs an impinging air jet directly onto electronic devices. The jet system was fabricated by a single manufacturing process using a resin-based three-dimensional printer, and monolithically integrates two nozzles, air delivery channel, flow distributor and mechanical fixtures within a volume of 80x80x80 mm3. To demonstrate the viability of the jet cooler, high power gallium nitride (GaN) transistors were cooled using air jets at up to 195 m/sec. With the air jet, a GaN transistor could dissipate heat flux up to 60 W/cm2, which was 7X larger than the maximum allowable heat flux under natural convection cooling. The air jet cooler is also capable of rapid switching of the cooling air. Direct impingement of air jet could reduce the GaN transistor temperature by ~70°C within 11 seconds. This work demonstrates the potential of additively manufactured air jet coolers as a compact thermal management scheme for high-power electronics. Since the geometry of the air jet coolers can be easily tailored to various shapes, the demonstrated concept can be applied for cooling a variety of electronics with different topologies and different layouts of hot spots.

AB - We report an air jet cooler made with additive manufacturing. The air jet cooler directs an impinging air jet directly onto electronic devices. The jet system was fabricated by a single manufacturing process using a resin-based three-dimensional printer, and monolithically integrates two nozzles, air delivery channel, flow distributor and mechanical fixtures within a volume of 80x80x80 mm3. To demonstrate the viability of the jet cooler, high power gallium nitride (GaN) transistors were cooled using air jets at up to 195 m/sec. With the air jet, a GaN transistor could dissipate heat flux up to 60 W/cm2, which was 7X larger than the maximum allowable heat flux under natural convection cooling. The air jet cooler is also capable of rapid switching of the cooling air. Direct impingement of air jet could reduce the GaN transistor temperature by ~70°C within 11 seconds. This work demonstrates the potential of additively manufactured air jet coolers as a compact thermal management scheme for high-power electronics. Since the geometry of the air jet coolers can be easily tailored to various shapes, the demonstrated concept can be applied for cooling a variety of electronics with different topologies and different layouts of hot spots.

KW - Additive manufacturing

KW - Convection cooling

KW - High-power electronics

KW - Impinging air jet

KW - Jet nozzle

UR - http://www.scopus.com/inward/record.url?scp=85073896446&partnerID=8YFLogxK

UR - http://www.scopus.com/inward/citedby.url?scp=85073896446&partnerID=8YFLogxK

U2 - 10.1109/ITHERM.2019.08757389

DO - 10.1109/ITHERM.2019.08757389

M3 - Conference contribution

AN - SCOPUS:85073896446

T3 - InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITHERM

SP - 941

EP - 945

BT - Proceedings of the 18th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems, ITherm 2019

PB - IEEE Computer Society

ER -