Additive manufacturing of metals at micro/nanoscale by localized pulsed electrodeposition: Nanotwinned copper nanowires

Soheil Daryadel, Ali Behroozfar, S. Reza Morsali, Rodrigo A. Bernal, Majid Minary

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Direct printing of three-dimensional nanoscale metallic wires with controlled microstructure is useful for applications in the 3D integrated circuits, flexible electronics and nanoelectronics. In this paper, we demonstrate the localized pulsed electrodeposition process for direct printing of 3D freestanding nanotwinned Copper (nt-Cu) nanowires. Nt-Cu offers unique mechanical and electrical properties, which are advantageous in different applications. Focused ion beam (FIB) analysis confirmed the nanocrystalline nanotwinned (nc-nt) microstructure of the wires. Mechanical properties of the 3D printed nc-nt Cu were characterized using in situ SEM microcompression experiments. The 3D printed nc-nt Cu exhibited a flow stress of over 960 MPa, which is outstanding for an additively manufactured material.

Original languageEnglish (US)
Title of host publicationAdditive Manufacturing; Bio and Sustainable Manufacturing
PublisherAmerican Society of Mechanical Engineers (ASME)
ISBN (Print)9780791851357
DOIs
StatePublished - 2018
Externally publishedYes
EventASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018 - College Station, United States
Duration: Jun 18 2018Jun 22 2018

Publication series

NameASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Volume1

Other

OtherASME 2018 13th International Manufacturing Science and Engineering Conference, MSEC 2018
Country/TerritoryUnited States
CityCollege Station
Period6/18/186/22/18

ASJC Scopus subject areas

  • Industrial and Manufacturing Engineering

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