Accurate models for optimizing tapered microchannel heat sinks in 3D ICs

Leslie Hwang, Beomjin Kwon, Martin Wong

Research output: Chapter in Book/Report/Conference proceedingConference contribution

2 Citations (Scopus)

Abstract

High-performance computing systems, especially 3D ICs, are yet facing thermal exacerbation. Inter-Tier liquid cooling microchannel layers have been introduced into 3D ICs as an integrated cooling mechanism to tackle thermal degradation. Many research works optimize microchannel designs based on runtime-expensive numerical simulations or inaccurate thermofluid models. In this work, we propose accurate closed-form models on tapered microchannel to capture the relationship between channel geometry and heat transfer performance. To improve the accuracy, our correlation is based on developing flow model and derived from numerical simulation using a subset of multiple channel parameters. Our models reduce error by 57 % in Nusselt number and 45 % in pressure drop for channels with inlet width 100-400μm compared to commonly used fully developed flow based models in optimization. Obtained correlations show potential as solid foundation to achieve close to optimal design through runtime-efficient microchannel design optimization.

Original languageEnglish (US)
Title of host publicationProceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018
PublisherIEEE Computer Society
Pages58-63
Number of pages6
ISBN (Print)9781538670996
DOIs
StatePublished - Aug 7 2018
Event17th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018 - Hong Kong, Hong Kong
Duration: Jul 9 2018Jul 11 2018

Publication series

NameProceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI
Volume2018-July
ISSN (Print)2159-3469
ISSN (Electronic)2159-3477

Conference

Conference17th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018
CountryHong Kong
CityHong Kong
Period7/9/187/11/18

Fingerprint

Heat sinks
Microchannels
Cooling
Computer simulation
Nusselt number
Pressure drop
Pyrolysis
Heat transfer
Geometry
Liquids

Keywords

  • 3D IC
  • Developing flow model
  • Inter-Tier liquid cooling
  • Microchannel
  • Tapered channel
  • Thermal optimization

ASJC Scopus subject areas

  • Hardware and Architecture
  • Control and Systems Engineering
  • Electrical and Electronic Engineering

Cite this

Hwang, L., Kwon, B., & Wong, M. (2018). Accurate models for optimizing tapered microchannel heat sinks in 3D ICs. In Proceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018 (pp. 58-63). [8429342] (Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI; Vol. 2018-July). IEEE Computer Society. https://doi.org/10.1109/ISVLSI.2018.00021

Accurate models for optimizing tapered microchannel heat sinks in 3D ICs. / Hwang, Leslie; Kwon, Beomjin; Wong, Martin.

Proceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018. IEEE Computer Society, 2018. p. 58-63 8429342 (Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI; Vol. 2018-July).

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Hwang, L, Kwon, B & Wong, M 2018, Accurate models for optimizing tapered microchannel heat sinks in 3D ICs. in Proceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018., 8429342, Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI, vol. 2018-July, IEEE Computer Society, pp. 58-63, 17th IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018, Hong Kong, Hong Kong, 7/9/18. https://doi.org/10.1109/ISVLSI.2018.00021
Hwang L, Kwon B, Wong M. Accurate models for optimizing tapered microchannel heat sinks in 3D ICs. In Proceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018. IEEE Computer Society. 2018. p. 58-63. 8429342. (Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI). https://doi.org/10.1109/ISVLSI.2018.00021
Hwang, Leslie ; Kwon, Beomjin ; Wong, Martin. / Accurate models for optimizing tapered microchannel heat sinks in 3D ICs. Proceedings - 2018 IEEE Computer Society Annual Symposium on VLSI, ISVLSI 2018. IEEE Computer Society, 2018. pp. 58-63 (Proceedings of IEEE Computer Society Annual Symposium on VLSI, ISVLSI).
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