Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

T. Sato; D. Sylvester; Yu Cao; C. Hu

Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

T. Sato, D. Sylvester, Yu Cao, C. Hu

Research output: Chapter in Book/Report/Conference proceeding › Conference contribution

Abstract

Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.

Original language	English (US)
Title of host publication	Digest of Technical Papers - IEEE International Solid-State Circuits Conference
Pages	226-227
Number of pages	2
State	Published - 2000
Externally published	Yes
Event	2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC - San Francisco, CA, United States Duration: Feb 7 2000 → Feb 9 2000

Other

Other	2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC
Country/Territory	United States
City	San Francisco, CA
Period	2/7/00 → 2/9/00

ASJC Scopus subject areas

Hardware and Architecture
Electrical and Electronic Engineering

Cite this

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title = "Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling",

abstract = "Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.",

author = "T. Sato and D. Sylvester and Yu Cao and C. Hu",

year = "2000",

language = "English (US)",

pages = "226--227",

booktitle = "Digest of Technical Papers - IEEE International Solid-State Circuits Conference",

note = "2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC ; Conference date: 07-02-2000 Through 09-02-2000",

}

TY - GEN

T1 - Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

AU - Sato, T.

AU - Sylvester, D.

AU - Cao, Yu

AU - Hu, C.

PY - 2000

Y1 - 2000

N2 - Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.

AB - Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.

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UR - http://www.scopus.com/inward/citedby.url?scp=0034428844&partnerID=8YFLogxK

M3 - Conference contribution

AN - SCOPUS:0034428844

SP - 226

EP - 227

BT - Digest of Technical Papers - IEEE International Solid-State Circuits Conference

T2 - 2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC

Y2 - 7 February 2000 through 9 February 2000

ER -

Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

Abstract

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ASJC Scopus subject areas

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