Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling

T. Sato, D. Sylvester, Yu Cao, C. Hu

Research output: Chapter in Book/Report/Conference proceedingConference contribution

8 Scopus citations

Abstract

Interconnect models were proposed to translate the analog behavior of interconnect coupling noise into digital output and reveal the actual waveform without uncertainties arising from parasitics in direct probing. A4-metal layer test chip was fabricated to demonstrate the use of in-situ measurement technique to evaluate subnanosecond on-chip coupling effects. Time domain technique was used to measure the signal delay for a wide range comparator (WRC) circuit implemented to capture transient waveforms. The analysis suggested increase in the driver size and reduction in the peak delay change as well as the noise pulse width.

Original languageEnglish (US)
Title of host publicationDigest of Technical Papers - IEEE International Solid-State Circuits Conference
Pages226-227
Number of pages2
StatePublished - 2000
Externally publishedYes
Event2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC - San Francisco, CA, United States
Duration: Feb 7 2000Feb 9 2000

Other

Other2000 IEEE International Solid-State Circuits Conference 47th Annual ISSCC
CountryUnited States
CitySan Francisco, CA
Period2/7/002/9/00

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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  • Cite this

    Sato, T., Sylvester, D., Cao, Y., & Hu, C. (2000). Accurate in-situ measurement of peak noise and signal delay induced by interconnect coupling. In Digest of Technical Papers - IEEE International Solid-State Circuits Conference (pp. 226-227)