TY - GEN
T1 - Accelerated Durability Evaluation of Emerging Cell Interconnect Technologies
AU - Li, Fang
AU - Colvin, Dylan J.
AU - Davis, Kristopher O.
AU - Gabor, Andrew
AU - Tamizhmani, Govinda Samy
N1 - Publisher Copyright:
© 2022 IEEE.
PY - 2022
Y1 - 2022
N2 - In this study, we investigate the durability of four different cell interconnect technologies using three long-term accelerated stress tests. The interconnect technologies investigated in this study are: conventional five busbar, tabbed interconnect ribbons (ribbon-tabbed); 12 busbar, soldered wire interconnects (soldered wire); shingled cell interconnects attached with an electrically conductive adhesive (shingled); and laminated wire interconnects with no busbar (laminated wire). The accelerated stress tests implemented in this study are: dynamic mechanical load followed by thermal cycling and humidity freeze (sequence 1); thermal cycling (500 cycles; sequence 2); damp heat (2000 hours; sequence 3). Overall, the average degradation of both modules in all the three sequences is found to be the lowest for the solder wire technology among the four investigated technologies assuming the influence of encapsulant and backsheet is identical in all the constructions.
AB - In this study, we investigate the durability of four different cell interconnect technologies using three long-term accelerated stress tests. The interconnect technologies investigated in this study are: conventional five busbar, tabbed interconnect ribbons (ribbon-tabbed); 12 busbar, soldered wire interconnects (soldered wire); shingled cell interconnects attached with an electrically conductive adhesive (shingled); and laminated wire interconnects with no busbar (laminated wire). The accelerated stress tests implemented in this study are: dynamic mechanical load followed by thermal cycling and humidity freeze (sequence 1); thermal cycling (500 cycles; sequence 2); damp heat (2000 hours; sequence 3). Overall, the average degradation of both modules in all the three sequences is found to be the lowest for the solder wire technology among the four investigated technologies assuming the influence of encapsulant and backsheet is identical in all the constructions.
KW - accelerated stress test
KW - cell interconnection
KW - durability
KW - reliability
KW - ribbon
KW - wire interconnection
UR - http://www.scopus.com/inward/record.url?scp=85142840758&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=85142840758&partnerID=8YFLogxK
U2 - 10.1109/PVSC48317.2022.9938674
DO - 10.1109/PVSC48317.2022.9938674
M3 - Conference contribution
AN - SCOPUS:85142840758
T3 - Conference Record of the IEEE Photovoltaic Specialists Conference
SP - 426
EP - 428
BT - 2022 IEEE 49th Photovoltaics Specialists Conference, PVSC 2022
PB - Institute of Electrical and Electronics Engineers Inc.
T2 - 49th IEEE Photovoltaics Specialists Conference, PVSC 2022
Y2 - 5 June 2022 through 10 June 2022
ER -