A TDC-based test platform for dynamic circuit aging characterization

Min Chen, Vijay Reddy, John Carulli, Srikanth Krishnan, Vijay Rentala, Venkatesh Srinivasan, Yu Cao

Research output: Chapter in Book/Report/Conference proceedingConference contribution

15 Citations (Scopus)

Abstract

An on-chip 45nm test platform that directly monitors circuit performance degradation during dynamic operation is demonstrated. In contrast to traditional ring-oscillator (RO) based frequency measurements, it utilizes a Time-to-Digital Converter (TDC) with 2ps resolution to efficiently monitor circuit delay change on-the-fly. This new technique allows the capability of measuring signal edge degradation under various realistic circuit operating scenarios, such as asymmetric aging, dynamic voltage/frequency scaling, dynamic duty cycle factors, and temperature variations.

Original languageEnglish (US)
Title of host publicationIEEE International Reliability Physics Symposium Proceedings
DOIs
StatePublished - 2011
Event49th International Reliability Physics Symposium, IRPS 2011 - Monterey, CA, United States
Duration: Apr 10 2011Apr 14 2011

Other

Other49th International Reliability Physics Symposium, IRPS 2011
CountryUnited States
CityMonterey, CA
Period4/10/114/14/11

Fingerprint

Aging of materials
Delay circuits
Degradation
Networks (circuits)
Electric potential
Temperature
Dynamic frequency scaling

Keywords

  • asymetric aging
  • duty cycle
  • NBTI
  • relibility
  • RO
  • TDC
  • test structure
  • variations

ASJC Scopus subject areas

  • Engineering(all)

Cite this

Chen, M., Reddy, V., Carulli, J., Krishnan, S., Rentala, V., Srinivasan, V., & Cao, Y. (2011). A TDC-based test platform for dynamic circuit aging characterization. In IEEE International Reliability Physics Symposium Proceedings [5784448] https://doi.org/10.1109/IRPS.2011.5784448

A TDC-based test platform for dynamic circuit aging characterization. / Chen, Min; Reddy, Vijay; Carulli, John; Krishnan, Srikanth; Rentala, Vijay; Srinivasan, Venkatesh; Cao, Yu.

IEEE International Reliability Physics Symposium Proceedings. 2011. 5784448.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Chen, M, Reddy, V, Carulli, J, Krishnan, S, Rentala, V, Srinivasan, V & Cao, Y 2011, A TDC-based test platform for dynamic circuit aging characterization. in IEEE International Reliability Physics Symposium Proceedings., 5784448, 49th International Reliability Physics Symposium, IRPS 2011, Monterey, CA, United States, 4/10/11. https://doi.org/10.1109/IRPS.2011.5784448
Chen M, Reddy V, Carulli J, Krishnan S, Rentala V, Srinivasan V et al. A TDC-based test platform for dynamic circuit aging characterization. In IEEE International Reliability Physics Symposium Proceedings. 2011. 5784448 https://doi.org/10.1109/IRPS.2011.5784448
Chen, Min ; Reddy, Vijay ; Carulli, John ; Krishnan, Srikanth ; Rentala, Vijay ; Srinivasan, Venkatesh ; Cao, Yu. / A TDC-based test platform for dynamic circuit aging characterization. IEEE International Reliability Physics Symposium Proceedings. 2011.
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