In this study, we investigated the possibility of fabricating flexible single-crystal Si-Pd diodes on polymer substrates using silver-filled conductive tape or epoxy. This simple technique mitigates the complexity of process-intensive metal-bonding schemes to achieve backside electrical contacts on semiconductor devices. The performance of such devices is evaluated while bent to a 1.2 cm radius of curvature. The longer-term stability of the devices fabricated is also briefly discussed.
|Original language||English (US)|
|Journal||Applied Physics Letters|
|State||Published - Feb 13 2012|
ASJC Scopus subject areas
- Physics and Astronomy (miscellaneous)