A study of single-crystal silicon diodes integrated on flexible substrates using conductive adhesives

C. Doran; W. Chen; Terry Alford; S. S. Lau

doi:10.1063/1.3684970

A study of single-crystal silicon diodes integrated on flexible substrates using conductive adhesives

C. Doran, W. Chen, Terry Alford, S. S. Lau

Research output: Contribution to journal › Article › peer-review

2 Scopus citations

Abstract

In this study, we investigated the possibility of fabricating flexible single-crystal Si-Pd diodes on polymer substrates using silver-filled conductive tape or epoxy. This simple technique mitigates the complexity of process-intensive metal-bonding schemes to achieve backside electrical contacts on semiconductor devices. The performance of such devices is evaluated while bent to a 1.2 cm radius of curvature. The longer-term stability of the devices fabricated is also briefly discussed.

Original language	English (US)
Article number	072103
Journal	Applied Physics Letters
Volume	100
Issue number	7
DOIs	https://doi.org/10.1063/1.3684970
State	Published - Feb 13 2012

ASJC Scopus subject areas

Physics and Astronomy (miscellaneous)

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10.1063/1.3684970

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abstract = "In this study, we investigated the possibility of fabricating flexible single-crystal Si-Pd diodes on polymer substrates using silver-filled conductive tape or epoxy. This simple technique mitigates the complexity of process-intensive metal-bonding schemes to achieve backside electrical contacts on semiconductor devices. The performance of such devices is evaluated while bent to a 1.2 cm radius of curvature. The longer-term stability of the devices fabricated is also briefly discussed.",

author = "C. Doran and W. Chen and Terry Alford and Lau, {S. S.}",

note = "Funding Information: UCSD and ASU acknowledge funding from NSF Grant DMR-Award No. 0902277. We also wish to thank Shadi Dayeh for helpful discussions.",

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AU - Lau, S. S.

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AB - In this study, we investigated the possibility of fabricating flexible single-crystal Si-Pd diodes on polymer substrates using silver-filled conductive tape or epoxy. This simple technique mitigates the complexity of process-intensive metal-bonding schemes to achieve backside electrical contacts on semiconductor devices. The performance of such devices is evaluated while bent to a 1.2 cm radius of curvature. The longer-term stability of the devices fabricated is also briefly discussed.

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A study of single-crystal silicon diodes integrated on flexible substrates using conductive adhesives

Abstract

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