Abstract

In this study, we investigated the possibility of fabricating flexible single-crystal Si-Pd diodes on polymer substrates using silver-filled conductive tape or epoxy. This simple technique mitigates the complexity of process-intensive metal-bonding schemes to achieve backside electrical contacts on semiconductor devices. The performance of such devices is evaluated while bent to a 1.2 cm radius of curvature. The longer-term stability of the devices fabricated is also briefly discussed.

Original languageEnglish (US)
Article number072103
JournalApplied Physics Letters
Volume100
Issue number7
DOIs
StatePublished - Feb 13 2012

ASJC Scopus subject areas

  • Physics and Astronomy (miscellaneous)

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