A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Chen Luen Shih, Bo Kuai Lai, Harold Kahn, Stephen Phillips, Arthur H. Heuer

Research output: Contribution to journalArticle

78 Citations (Scopus)

Abstract

Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described.

Original languageEnglish (US)
Pages (from-to)69-79
Number of pages11
JournalJournal of Microelectromechanical Systems
Volume10
Issue number1
DOIs
StatePublished - Mar 2001
Externally publishedYes

Fingerprint

Shape memory effect
MEMS
Sputtering
Fabrication
Microactuators
Thin films
Temperature

Keywords

  • Microactuators
  • Shape-memory alloys
  • Sputtering
  • TiNi

ASJC Scopus subject areas

  • Electrical and Electronic Engineering
  • Mechanical Engineering

Cite this

A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS. / Shih, Chen Luen; Lai, Bo Kuai; Kahn, Harold; Phillips, Stephen; Heuer, Arthur H.

In: Journal of Microelectromechanical Systems, Vol. 10, No. 1, 03.2001, p. 69-79.

Research output: Contribution to journalArticle

Shih, Chen Luen ; Lai, Bo Kuai ; Kahn, Harold ; Phillips, Stephen ; Heuer, Arthur H. / A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS. In: Journal of Microelectromechanical Systems. 2001 ; Vol. 10, No. 1. pp. 69-79.
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