A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS

Chen Luen Shih, Bo Kuai Lai, Harold Kahn, Stephen M. Phillips, Arthur H. Heuer

Research output: Contribution to journalArticlepeer-review

84 Scopus citations

Abstract

Co-sputtering has been used to fabricate equiatomic thin films of TiNi, a shape memory alloy which form the basis of microactuators with many applications in MEMS. Methods for overcoming the difficulties involved in obtaining equiatomic TiNi thin films with high transformation temperatures, and a robust procedure suitable for batch fabrication in a production environment, are described.

Original languageEnglish (US)
Pages (from-to)69-79
Number of pages11
JournalJournal of Microelectromechanical Systems
Volume10
Issue number1
DOIs
StatePublished - Mar 2001
Externally publishedYes

Keywords

  • Microactuators
  • Shape-memory alloys
  • Sputtering
  • TiNi

ASJC Scopus subject areas

  • Mechanical Engineering
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'A robust co-sputtering fabrication procedure for TiNi shape memory alloys for MEMS'. Together they form a unique fingerprint.

Cite this