Abstract

The ease of fabrication and wide application of printed microelectronics are driving advances in reactive inks. The long-term performance of structures printed using reactive ink is important for their application in microelectronics. In this study, silver lines are printed with low-temperature, self-reducing, silver-diamine based ink. The electromigration failure of the printed silver is first studied using Black's equation. However, due to the porous nature of the printed Ag line, Black's equation is not the best fit for predicting the lifetime, this is because Black's equation does not take into account morphology-induced current crowding. We find that the resistivity of the printed Ag lines can be described (as a function of void fraction) by percolation theory. In addition, we also demonstrate that the failure lifetimes of the printed Ag can be predicted quite well by a percolative model of failure.

Original languageEnglish (US)
Article number125104
JournalJournal of Applied Physics
Volume120
Issue number12
DOIs
StatePublished - Sep 28 2016

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electromigration
inks
silver
microelectronics
life (durability)
crowding
diamines
voids
fabrication
electrical resistivity

ASJC Scopus subject areas

  • Physics and Astronomy(all)

Cite this

A percolative approach to investigate electromigration failure in printed Ag structures. / Zhao, Zhao; Mamidanna, Avinash; Lefky, Christopher; Hildreth, Owen; Alford, Terry.

In: Journal of Applied Physics, Vol. 120, No. 12, 125104, 28.09.2016.

Research output: Contribution to journalArticle

Zhao, Zhao ; Mamidanna, Avinash ; Lefky, Christopher ; Hildreth, Owen ; Alford, Terry. / A percolative approach to investigate electromigration failure in printed Ag structures. In: Journal of Applied Physics. 2016 ; Vol. 120, No. 12.
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